Expert system advisor for solder paste selection

A. Maria; K. Srihari; C. R. Emerson; G. Westby

Expert system advisor for solder paste selection

A. Maria
, K. Srihari
, C. R. Emerson
, G. Westby

School of Sys Sci Ind Engr

Binghamton University

State University of New York Binghamton University

Research output: Contribution to journal › Conference article › peer-review

2 Scopus citations

Abstract

This paper describes the design and development of a knowledge based expert system that could assist manufacturing engineers engaged in the surface mount manufacture of Printed Circuit Boards (PCBs) in solder paste selection. The critical role of solder paste in Surface Mount Technology (SMT) is discussed. Solder paste selection criteria as they apply to PCB assembly using SMT are delineated. The overall architecture, knowledge base, inference mechanism, and the user interface of the solder paste selection expert system are described.

Original language	English
Pages (from-to)	555-564
Number of pages	10
Journal	National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East)
Volume	2
State	Published - 1992
Event	NEPCON West '92 - Anaheim, CA, USA Duration: Feb 23 1992 → Feb 27 1992

Cite this

@article{ceceb73cb87442128ab39515f2a1d0f8,

title = "Expert system advisor for solder paste selection",

abstract = "This paper describes the design and development of a knowledge based expert system that could assist manufacturing engineers engaged in the surface mount manufacture of Printed Circuit Boards (PCBs) in solder paste selection. The critical role of solder paste in Surface Mount Technology (SMT) is discussed. Solder paste selection criteria as they apply to PCB assembly using SMT are delineated. The overall architecture, knowledge base, inference mechanism, and the user interface of the solder paste selection expert system are described.",

author = "A. Maria and K. Srihari and Emerson, \{C. R.\} and G. Westby",

year = "1992",

language = "English",

volume = "2",

pages = "555--564",

journal = "National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East)",

issn = "0470-0155",

note = "NEPCON West '92 ; Conference date: 23-02-1992 Through 27-02-1992",

}

TY - JOUR

T1 - Expert system advisor for solder paste selection

AU - Maria, A.

AU - Srihari, K.

AU - Emerson, C. R.

AU - Westby, G.

PY - 1992

Y1 - 1992

N2 - This paper describes the design and development of a knowledge based expert system that could assist manufacturing engineers engaged in the surface mount manufacture of Printed Circuit Boards (PCBs) in solder paste selection. The critical role of solder paste in Surface Mount Technology (SMT) is discussed. Solder paste selection criteria as they apply to PCB assembly using SMT are delineated. The overall architecture, knowledge base, inference mechanism, and the user interface of the solder paste selection expert system are described.

AB - This paper describes the design and development of a knowledge based expert system that could assist manufacturing engineers engaged in the surface mount manufacture of Printed Circuit Boards (PCBs) in solder paste selection. The critical role of solder paste in Surface Mount Technology (SMT) is discussed. Solder paste selection criteria as they apply to PCB assembly using SMT are delineated. The overall architecture, knowledge base, inference mechanism, and the user interface of the solder paste selection expert system are described.

UR - https://www.scopus.com/pages/publications/0026678876

M3 - Conference article

SN - 0470-0155

VL - 2

SP - 555

EP - 564

JO - National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East)

JF - National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East)

T2 - NEPCON West '92

Y2 - 23 February 1992 through 27 February 1992

ER -

Expert system advisor for solder paste selection

Abstract

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