TY - GEN
T1 - Failure modes and FEM analysis of power electronic packaging
AU - Ye, Hua
AU - Lin, Minghui
AU - Basaran, Cemal
PY - 2001
Y1 - 2001
N2 - The development of power electronics technology is driven by the insatiate demand to control electrical power. The new power electronics devices make the volume of the converters a reduction of three to four orders of magnitude compared to their mercury arc predecessor. And the turn-on and turn-off time has decreased from the millisecond region to the microsecond region and even nanosecond depending on power level. The power range commanded by converters now extends from micro-VA to several hundreds of MVA. Among the new power devices, IGBT (Insulated gate bipolar transistor) devices are getting more acceptances and increasingly used in traction application such as locomotive, elevator, tram and subway. Thus the long-term reliability of IGBT is highly demanded In this paper the failure modes of power electronics devices especially IGBTs are reviewed. A FEM analysis of a multilayered IGBT packaging module under cyclic thermal loading is presented.
AB - The development of power electronics technology is driven by the insatiate demand to control electrical power. The new power electronics devices make the volume of the converters a reduction of three to four orders of magnitude compared to their mercury arc predecessor. And the turn-on and turn-off time has decreased from the millisecond region to the microsecond region and even nanosecond depending on power level. The power range commanded by converters now extends from micro-VA to several hundreds of MVA. Among the new power devices, IGBT (Insulated gate bipolar transistor) devices are getting more acceptances and increasingly used in traction application such as locomotive, elevator, tram and subway. Thus the long-term reliability of IGBT is highly demanded In this paper the failure modes of power electronics devices especially IGBTs are reviewed. A FEM analysis of a multilayered IGBT packaging module under cyclic thermal loading is presented.
UR - https://www.scopus.com/pages/publications/0346938571
M3 - Conference contribution
SN - 0791835405
T3 - Advances in Electronic Packaging
SP - 417
EP - 428
BT - Advances in Electronic Packaging; Electrical Design, Simulation, and Test, Mems, Materials and Processing, Modeling and Characterization
T2 - Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition
Y2 - 8 July 2001 through 13 July 2001
ER -