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Film properties of ALD HfO 2 and La 2O 3 gate dielectrics grown on Si with various pre-deposition treatments

  • D. H. Triyoso
  • , R. I. Hegde
  • , J. Grant
  • , P. Fejes
  • , R. Liu
  • , D. Roan
  • , M. Ramon
  • , D. Werho
  • , R. Rai
  • , L. B. La
  • , J. Baker
  • , C. Garza
  • , T. Guenther
  • , B. E. White
  • , P. J. Tobin
  • Freescale Semiconductor

Research output: Contribution to journalArticlepeer-review

76 Scopus citations

Abstract

The film properties of ALD HFO 2 and La 2O 3 in contact with silicon substrate were investigated. The gate dielectrics were formed using ALD in a cross-flow reactor, and film thickness was controlled by the number of deposition cycles. Cross-sectional TEM was obtained to examine the La 2O 3-Si interface, and MOSCAPs were fabricated using a platinum shadow mask technique to study the impact of the different pre-treatments on ALD dielectric's electrical characteristics. The results show that HfO 2 is stable in contact with Si, and that various pre-deposition treatments result in films with good electrical and physical properties.

Original languageEnglish
Pages (from-to)2121-2127
Number of pages7
JournalJournal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Volume22
Issue number4
DOIs
StatePublished - Jul 2004

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