Abstract
The film properties of ALD HFO 2 and La 2O 3 in contact with silicon substrate were investigated. The gate dielectrics were formed using ALD in a cross-flow reactor, and film thickness was controlled by the number of deposition cycles. Cross-sectional TEM was obtained to examine the La 2O 3-Si interface, and MOSCAPs were fabricated using a platinum shadow mask technique to study the impact of the different pre-treatments on ALD dielectric's electrical characteristics. The results show that HfO 2 is stable in contact with Si, and that various pre-deposition treatments result in films with good electrical and physical properties.
| Original language | English |
|---|---|
| Pages (from-to) | 2121-2127 |
| Number of pages | 7 |
| Journal | Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures |
| Volume | 22 |
| Issue number | 4 |
| DOIs | |
| State | Published - Jul 2004 |
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