TY - GEN
T1 - Flip-chip packaging with micromachined conductive polymer bumps
AU - Oh, K. W.
AU - Ahn, C. H.
N1 - Publisher Copyright: © 1998 IEEE.
PY - 1998
Y1 - 1998
N2 - A new conductive polymer flip-chip bonding technique has been developed and characterized using micromachined conductive polymer bumps. By using UV-based photolithography with thick photoresists, molds for the flip-chip bumps have been patterned, filled with conductive polymers, selectively cured, and then stripped, leaving molded conductive polymer bumps on contact metal pads. After flip-chip bonding with the micromachined conductive polymer bumps, the contact resistances measured for 25 μm-high bumps with 300 μm×300 μm area and 400 μm×400 μm area were 35 mω and 12 mω, respectively. The conductive polymer flip-chip bonding technique developed in this work showed a very low contact resistance, simple processing steps, a high bumping alignment resolution (<±5 μm), and a lower bonding temperature (∼170°C).
AB - A new conductive polymer flip-chip bonding technique has been developed and characterized using micromachined conductive polymer bumps. By using UV-based photolithography with thick photoresists, molds for the flip-chip bumps have been patterned, filled with conductive polymers, selectively cured, and then stripped, leaving molded conductive polymer bumps on contact metal pads. After flip-chip bonding with the micromachined conductive polymer bumps, the contact resistances measured for 25 μm-high bumps with 300 μm×300 μm area and 400 μm×400 μm area were 35 mω and 12 mω, respectively. The conductive polymer flip-chip bonding technique developed in this work showed a very low contact resistance, simple processing steps, a high bumping alignment resolution (<±5 μm), and a lower bonding temperature (∼170°C).
UR - https://www.scopus.com/pages/publications/80051766240
U2 - 10.1109/ADHES.1998.742031
DO - 10.1109/ADHES.1998.742031
M3 - Conference contribution
T3 - Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998
SP - 224
EP - 228
BT - Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998, ADHES 1998
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, ADHES 1998
Y2 - 28 September 1998 through 30 September 1998
ER -