Flip chip solder joint failure modes

Cemal Basaran; H. Ye; D. C. Hopkins; D. Frear; J. K. Lin

Flip chip solder joint failure modes

Cemal Basaran
, H. Ye
, D. C. Hopkins
, D. Frear
, J. K. Lin

Department of Civil, Structural & Environmental Engineering

University at Buffalo

Research output: Contribution to specialist publication › Article

7 Scopus citations

Abstract

The phenomena of electromigration in solder joints under high direct-current density for microelectronic packaging and power electronics packaging was studied. It is observed that the current density will increase further as chip voltage decreases and absolute current levels increase. During the experiments failure modes resulted from joule heating and a lack of cooling in the specimen. It was found that the thermomigration dominated the failure process significantly.

Original language	English
Pages	14-19
Number of pages	6
Volume	14
No	10
Specialist publication	Advanced Packaging
State	Published - Oct 2005

Cite this

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title = "Flip chip solder joint failure modes",

abstract = "The phenomena of electromigration in solder joints under high direct-current density for microelectronic packaging and power electronics packaging was studied. It is observed that the current density will increase further as chip voltage decreases and absolute current levels increase. During the experiments failure modes resulted from joule heating and a lack of cooling in the specimen. It was found that the thermomigration dominated the failure process significantly.",

author = "Cemal Basaran and H. Ye and Hopkins, \{D. C.\} and D. Frear and Lin, \{J. K.\}",

year = "2005",

month = oct,

language = "English",

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journal = "Advanced Packaging",

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T1 - Flip chip solder joint failure modes

AU - Basaran, Cemal

AU - Ye, H.

AU - Hopkins, D. C.

AU - Frear, D.

AU - Lin, J. K.

PY - 2005/10

Y1 - 2005/10

N2 - The phenomena of electromigration in solder joints under high direct-current density for microelectronic packaging and power electronics packaging was studied. It is observed that the current density will increase further as chip voltage decreases and absolute current levels increase. During the experiments failure modes resulted from joule heating and a lack of cooling in the specimen. It was found that the thermomigration dominated the failure process significantly.

AB - The phenomena of electromigration in solder joints under high direct-current density for microelectronic packaging and power electronics packaging was studied. It is observed that the current density will increase further as chip voltage decreases and absolute current levels increase. During the experiments failure modes resulted from joule heating and a lack of cooling in the specimen. It was found that the thermomigration dominated the failure process significantly.

UR - https://www.scopus.com/pages/publications/27744592244

M3 - Article

SN - 1065-0555

VL - 14

SP - 14

EP - 19

JO - Advanced Packaging

JF - Advanced Packaging

ER -

Flip chip solder joint failure modes

Abstract

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