Foreword: Special issue of components and packaging technologies with contributions from ITherm 2004 Thermal Management Track

Koneru Ramakrishna; Bahgat G. Sammakia; J. Richard Culham; Yogendra K. Joshi

doi:10.1109/TCAPT.2005.848625

Foreword: Special issue of components and packaging technologies with contributions from ITherm 2004 Thermal Management Track

Koneru Ramakrishna
, Bahgat G. Sammakia
, J. Richard Culham
, Yogendra K. Joshi

Mechanical Engineering

Binghamton University

Freescale Semiconductor
University of Waterloo
Georgia Institute of Technology

Research output: Contribution to journal › Editorial

Original language	English
Pages (from-to)	179-181
Number of pages	3
Journal	IEEE Transactions on Components and Packaging Technologies
Volume	28
Issue number	2
DOIs	https://doi.org/10.1109/TCAPT.2005.848625
State	Published - Jun 2005

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10.1109/TCAPT.2005.848625

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@article{12883fe93240427390961fc363f17f70,

title = "Foreword: Special issue of components and packaging technologies with contributions from ITherm 2004 Thermal Management Track",

author = "Koneru Ramakrishna and Sammakia, \{Bahgat G.\} and Culham, \{J. Richard\} and Joshi, \{Yogendra K.\}",

year = "2005",

month = jun,

doi = "10.1109/TCAPT.2005.848625",

language = "English",

volume = "28",

pages = "179--181",

journal = "IEEE Transactions on Components and Packaging Technologies",

issn = "1521-3331",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "2",

}

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T1 - Foreword

T2 - Special issue of components and packaging technologies with contributions from ITherm 2004 Thermal Management Track

AU - Ramakrishna, Koneru

AU - Sammakia, Bahgat G.

AU - Culham, J. Richard

AU - Joshi, Yogendra K.

PY - 2005/6

Y1 - 2005/6

UR - https://www.scopus.com/pages/publications/21044433183

U2 - 10.1109/TCAPT.2005.848625

DO - 10.1109/TCAPT.2005.848625

M3 - Editorial

SN - 1521-3331

VL - 28

SP - 179

EP - 181

JO - IEEE Transactions on Components and Packaging Technologies

JF - IEEE Transactions on Components and Packaging Technologies

IS - 2

ER -

Foreword: Special issue of components and packaging technologies with contributions from ITherm 2004 Thermal Management Track

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