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Foreword: Special section on ITherm 2004 Mechanics track

  • Freescale Semiconductor
  • Nanyang Technological University
  • Motorola

Research output: Contribution to journalEditorial

Original languageEnglish
Pages (from-to)387-389
Number of pages3
JournalIEEE Transactions on Components and Packaging Technologies
Volume28
Issue number3
DOIs
StatePublished - Sep 2005

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