TY - GEN
T1 - Heterogeneous Photonic-Electronic Platform with Slow-Wave Mach-Zehnder Modulator for High Bandwidth-Density Co-Packaged Optics
AU - Lin, Nathan C.
AU - McDonough, Colin
AU - Carroll, Robert
AU - Begović, Amir
AU - Kruger, Seth
AU - Baranowski, Sarah
AU - Ngai, Tat
AU - Striemer, Christopher
AU - Dikshit, Amit
AU - Baiocco, Chris
AU - Harame, David
N1 - Publisher Copyright: © Optica Publishing Group 2025 © 2025 The Author(s)
PY - 2025
Y1 - 2025
N2 - By embedding the silicon photonics wafer with TSVs and RDLs, we demonstrate a 300 mm photonic-electronic interposer platform for heterogeneous integration of PICs, EICs, with slow-wave modulators and photodetectors for high-density, scalable co-packaged optics systems.
AB - By embedding the silicon photonics wafer with TSVs and RDLs, we demonstrate a 300 mm photonic-electronic interposer platform for heterogeneous integration of PICs, EICs, with slow-wave modulators and photodetectors for high-density, scalable co-packaged optics systems.
UR - https://www.scopus.com/pages/publications/105032430166
U2 - 10.1364/FIO.2025.FM4D.1
DO - 10.1364/FIO.2025.FM4D.1
M3 - Conference contribution
T3 - Frontiers in Optics, FiO 2025 in Proceedings Frontiers in Optics + Laser Science 2025 ,FiO, LS - Part of Frontiers in Optics + Laser Science 2025
BT - Frontiers in Optics, FiO 2025 in Proceedings Frontiers in Optics + Laser Science 2025 ,FiO, LS - Part of Frontiers in Optics + Laser Science 2025
PB - Optical Society of America
T2 - 2025 Frontiers in Optics, FiO 2025
Y2 - 26 October 2025 through 30 October 2025
ER -