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High quality 100 mm 4H-SiC substrate

  • Yu Qiang Gao
  • , Hong Yan Zhang
  • , Jian Song
  • , Sheng Song
  • , Qing Rui Liang
  • , Min Ning
  • , Chao Gao
  • , Xi Jie Wang
  • , Yan Min Zong
  • , Huan Huan Wang
  • , Michael Dudley
  • SICC Company Limited
  • Stony Brook University

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

High-quality 100 mm 4H-SiC boules were grown using the physical vapor transport (PVT) method with optimized growth parameters. Micro-Raman spectroscopy measurement shows that the 4H-SiC polytype of the entire wafer is uniform. The micropipe density is measured to be less than 1cm-2. The 1c threading screw dislocation (TSD) density can be suppressed to the magnitude of 102 cm-2. After chemical mechanical polishing (CMP), it is found that the warp of the substrate is less than 10 μm, and the surface roughness (Ra) is as low as 0.063 nm.

Original languageEnglish
Title of host publicationSilicon Carbide and Related Materials 2014
EditorsDidier Chaussende, Gabriel Ferro
PublisherTrans Tech Publications Ltd
Pages51-55
Number of pages5
ISBN (Print)9783038354789
DOIs
StatePublished - 2015
EventEuropean Conference on Silicon Carbide and Related Materials, ECSCRM 2014 - Grenoble, France
Duration: Sep 21 2014Sep 25 2014

Publication series

NameMaterials Science Forum
Volume821-823

Conference

ConferenceEuropean Conference on Silicon Carbide and Related Materials, ECSCRM 2014
Country/TerritoryFrance
CityGrenoble
Period09/21/1409/25/14

Keywords

  • 4H-SiC
  • Dislocation
  • Silicon carbide
  • Substrate

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