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High-temperature, high-density packaging of a 60kW converter for >200°C embedded operation

  • D. C. Hopkins
  • , D. W. Kellerman
  • , R. A. Wunderlich
  • , C. Basaran
  • , J. Gomez

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

22 Scopus citations

Abstract

This paper describes the design of a 60kW, actuator motor drive using high temperature SiC devices. Power JFET devices are selected for high-frequency performance and high density. High-density packaging uses an aluminum conductor, A1N substrate and AlSiC combination to minimize dissimilar interfaces. The forced air-cooled design provides >1.1kW/cu.in.

Original languageEnglish
Title of host publicationTwenty-First Annual IEEE Applied Power Electronics Conference and Exposition, APEC '06
Pages871-877
Number of pages7
StatePublished - 2006
Event21st Annual IEEE Applied Power Electronics Conference and Exposition, APEC '06 - Dallas, TX, United States
Duration: Mar 19 2006Mar 23 2006

Publication series

NameConference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC
Volume2006

Conference

Conference21st Annual IEEE Applied Power Electronics Conference and Exposition, APEC '06
Country/TerritoryUnited States
CityDallas, TX
Period03/19/0603/23/06

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