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Improved frequency response in a SiGe npn device through improved dopant activation

  • J. W. Adkisson
  • , M. H. Khater
  • , J. P. Gambino
  • , P. Cheng
  • , V. Jain
  • , R. A. Camillo-Castillo
  • , C. Lavoie
  • , A. K. Sutton
  • , O. Gluschenkov
  • , Q. Z. Liu
  • , T. L. McDevitt
  • , S. U. Engelmann
  • , J. J. Pekarik
  • , D. L. Harame
  • Global Foundries, Inc.
  • IBM

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Scopus citations

Abstract

We study the impact of improved dopant activation in a BiCMOS SiGe technology, using laser annealing to improve activation, and a low temperature contact module to avoid de-activation. We present the results of simple DC test structure measurements and high frequency bipolar transistor measurements. Improved activation significantly reduces sheet resistance, particularly for polysilicon layers. Likewise, reductions in the bipolar device resistance parasitics cause an improvement in maximum power gain frequency (f MAX).

Original languageEnglish
Title of host publicationSiGe, Ge, and Related Compounds 5
Subtitle of host publicationMaterials, Processing, and Devices
PublisherElectrochemical Society Inc.
Pages83-93
Number of pages11
Edition9
ISBN (Print)9781607683575
DOIs
StatePublished - 2013
Event5th SiGe, Ge, and Related Compounds: Materials, Processing and Devices Symposium - 220th ECS Meeting - Honolulu, HI, United States
Duration: Oct 7 2012Oct 12 2012

Publication series

NameECS Transactions
Number9
Volume50

Conference

Conference5th SiGe, Ge, and Related Compounds: Materials, Processing and Devices Symposium - 220th ECS Meeting
Country/TerritoryUnited States
CityHonolulu, HI
Period10/7/1210/12/12

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