Abstract
We report the effect of a high-temperature forming gas anneal (FGA) on the electrical characteristics and threshold voltage (VT) instability of high-mobility Si-face (0001) 4H-SiC metal oxide semiconductor field effect transistors (MOSFETs) with lanthanum silicate (LaSiOx). The MOSFET with LaSiOx after 800 °C FGA in 5% H2 and 95% N2 mixture shows significantly reduced VT shift under 3-MV/cm positive bias stressing from 2.78 to 1.65 V, while maintaining high field-effect mobility of 122.7 cm2/Vs and sufficiently positive VT of 2.76 V.
| Original language | English |
|---|---|
| Article number | 8233202 |
| Pages (from-to) | 244-247 |
| Number of pages | 4 |
| Journal | IEEE Electron Device Letters |
| Volume | 39 |
| Issue number | 2 |
| DOIs | |
| State | Published - Feb 2018 |
Keywords
- 4H-SiC
- atomic layer deposition
- electron mobility
- forming gas anneal
- lanthanum silicate
- threshold voltage
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