@inproceedings{0b5a020d8a014fc384118757fbd3b172,
title = "Improving Ruthenium Polishing through the use of Ceria Abrasives",
abstract = "Ceria abrasive particles can polish oxides through both mechanical and chemical means. Standard metal polishing occurs through the addition of oxidizing agents to form weaker oxide films that are easier to remove mechanically by silica particles. By replacing this silica with ceria, ruthenium removal rate and roughness can be improved while lowering both the oxidizing agent and abrasive concentration.",
keywords = "AFM, CMP, ceria, ruthenium, silica",
author = "Christopher Netzband and Kathleen Dunn",
note = "Publisher Copyright: {\textcopyright} 2020 IEEE.; 2020 IEEE International Interconnect Technology Conference, IITC 2020 ; Conference date: 05-10-2020 Through 09-10-2020",
year = "2020",
month = oct,
day = "5",
doi = "10.1109/IITC47697.2020.9515659",
language = "English",
series = "2020 IEEE International Interconnect Technology Conference, IITC 2020",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "70--72",
booktitle = "2020 IEEE International Interconnect Technology Conference, IITC 2020",
}