Abstract
The influence of seed preparation on crystal defect generation is studied by investigating the effect of damage from surface scratches not completely removed during polishing on the seed crystal on the nucleation and evolution of dislocation arrays. Synchrotron X-ray topography is conducted on several wafers sliced from a PVT-grown 4H-SiC boule. Topographic results in conjunction with ray tracing simulation reveal the generation of TSD/TMD and TED arrays associated with the scratches in the newly grown wafer adjacent to the seed. Configuration transformation of those arrays is observed as these opposite-signed dislocation pairs composing the arrays were affected by the overgrowth of macro-steps when propagating into the newly grown crystal.
| Original language | English |
|---|---|
| Pages (from-to) | 71-80 |
| Number of pages | 10 |
| Journal | Defect and Diffusion Forum |
| Volume | 434 |
| DOIs | |
| State | Published - 2024 |
Keywords
- crystal growth
- dislocation array
- low angle grain boundary
- scratch
- silicon carbide
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