Abstract
This paper presents the results of an experimental study of large strain tensile and cyclic damage in nano-scale gold (Au) thin films that were electron-beam deposited onto a 1mm thick polymeric substrate of poly-di-methyl-siloxane (PDMS). The effects of Au film thickness are examined for films with thicknesses of 50, 75 and 100 nm. Large strain deformation (up to 100%) is shown to give rise to grain boundary cracking that results in significant changes in film resistance under monotonic and cyclic loading. The implications of the results are discussed for development of flexible electronic structures.
| Original language | English |
|---|---|
| Pages (from-to) | 32-40 |
| Number of pages | 9 |
| Journal | Materials Science and Engineering B: Solid-State Materials for Advanced Technology |
| Volume | 170 |
| Issue number | 1-3 |
| DOIs | |
| State | Published - Jun 15 2010 |
Keywords
- Flexible electronics
- Grain boundary cracking
- Large strain deformation
- Resistance changes
- Tensile and cyclic damage
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