Abstract
Polyethylene-glycol-based thermal interface paste containing trifluoroacetic acid lithium salt (1.5 wt. percent optimum) and boron nitride particles (∼18.0 vol. percent optimum), as well as water and N. N-dimethylformamide for helping the dissociation of the salt to release Li+ ions, gives thermal contact conductance that is almost as high as that given by Sn-Pb solder, similar to that given by boron nitride particle filled sodium silicate, and much higher than that given by boron nitride particle filled silicone.
| Original language | English |
|---|---|
| Pages (from-to) | 188-191 |
| Number of pages | 4 |
| Journal | Journal of Electronic Packaging |
| Volume | 124 |
| Issue number | 3 |
| DOIs | |
| State | Published - Sep 2002 |
Keywords
- Boron Nitride
- Composite
- Lithium
- Polyethylene Glycol
- Polymer
- Thermal Conductance
- Thermal Contact
- Thermal Interface
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