Material and reliability considerations for anisotropically conductive adhesive based interconnects

J. Dion; P. Borgesen; B. Yost; D. A. Lilienfeld; C. Y. Li

Material and reliability considerations for anisotropically conductive adhesive based interconnects

J. Dion
, P. Borgesen
, B. Yost
, D. A. Lilienfeld
, C. Y. Li

School of Sys Sci Ind Engr

Binghamton University

Cornell University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

3 Scopus citations

Abstract

An adhesive based interconnect design in which the contract force between a bumped die and substrate is maintained by the shrinkage stress of the adhesive was investigated for use in high performance applications. In general, heating will reduce the contact force because of the differential thermal expansions and local relaxation in the adhesive. Special experimental techniques have been developed to measure the relevant materials properties. The potential for optimization in terms of materials selection is discussed.

Original language	English
Title of host publication	Electronic Packaging Materials Science VII
Editors	Peter Borgesen, Klavs F. Jensen, Roger A. Pollak
Publisher	Publ by Materials Research Society
Pages	27-32
Number of pages	6
ISBN (Print)	1558992227
State	Published - 1994
Event	Proceedings of the Fall 1993 MRS Meeting - Boston, MA, USA Duration: Nov 29 1993 → Dec 3 1993

Publication series

Name	Materials Research Society Symposium Proceedings
Volume	323

Conference

Conference	Proceedings of the Fall 1993 MRS Meeting
City	Boston, MA, USA
Period	11/29/93 → 12/3/93

Cite this

Dion, J., Borgesen, P., Yost, B., Lilienfeld, D. A., & Li, C. Y. (1994). Material and reliability considerations for anisotropically conductive adhesive based interconnects. In P. Borgesen, K. F. Jensen, & R. A. Pollak (Eds.), Electronic Packaging Materials Science VII (pp. 27-32). (Materials Research Society Symposium Proceedings; Vol. 323). Publ by Materials Research Society.

@inproceedings{8f44f726296d44a284a876deb7922770,

title = "Material and reliability considerations for anisotropically conductive adhesive based interconnects",

abstract = "An adhesive based interconnect design in which the contract force between a bumped die and substrate is maintained by the shrinkage stress of the adhesive was investigated for use in high performance applications. In general, heating will reduce the contact force because of the differential thermal expansions and local relaxation in the adhesive. Special experimental techniques have been developed to measure the relevant materials properties. The potential for optimization in terms of materials selection is discussed.",

author = "J. Dion and P. Borgesen and B. Yost and Lilienfeld, \{D. A.\} and Li, \{C. Y.\}",

year = "1994",

language = "English",

isbn = "1558992227",

series = "Materials Research Society Symposium Proceedings",

publisher = "Publ by Materials Research Society",

pages = "27--32",

editor = "Peter Borgesen and Jensen, \{Klavs F.\} and Pollak, \{Roger A.\}",

booktitle = "Electronic Packaging Materials Science VII",

note = "Proceedings of the Fall 1993 MRS Meeting ; Conference date: 29-11-1993 Through 03-12-1993",

}

Dion, J, Borgesen, P, Yost, B, Lilienfeld, DA & Li, CY 1994, Material and reliability considerations for anisotropically conductive adhesive based interconnects. in P Borgesen, KF Jensen & RA Pollak (eds), Electronic Packaging Materials Science VII. Materials Research Society Symposium Proceedings, vol. 323, Publ by Materials Research Society, pp. 27-32, Proceedings of the Fall 1993 MRS Meeting, Boston, MA, USA, 11/29/93.

Material and reliability considerations for anisotropically conductive adhesive based interconnects. / Dion, J.; Borgesen, P.; Yost, B. et al.
Electronic Packaging Materials Science VII. ed. / Peter Borgesen; Klavs F. Jensen; Roger A. Pollak. Publ by Materials Research Society, 1994. p. 27-32 (Materials Research Society Symposium Proceedings; Vol. 323).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Material and reliability considerations for anisotropically conductive adhesive based interconnects

AU - Dion, J.

AU - Borgesen, P.

AU - Yost, B.

AU - Lilienfeld, D. A.

AU - Li, C. Y.

PY - 1994

Y1 - 1994

N2 - An adhesive based interconnect design in which the contract force between a bumped die and substrate is maintained by the shrinkage stress of the adhesive was investigated for use in high performance applications. In general, heating will reduce the contact force because of the differential thermal expansions and local relaxation in the adhesive. Special experimental techniques have been developed to measure the relevant materials properties. The potential for optimization in terms of materials selection is discussed.

AB - An adhesive based interconnect design in which the contract force between a bumped die and substrate is maintained by the shrinkage stress of the adhesive was investigated for use in high performance applications. In general, heating will reduce the contact force because of the differential thermal expansions and local relaxation in the adhesive. Special experimental techniques have been developed to measure the relevant materials properties. The potential for optimization in terms of materials selection is discussed.

UR - https://www.scopus.com/pages/publications/0028125348

M3 - Conference contribution

SN - 1558992227

T3 - Materials Research Society Symposium Proceedings

SP - 27

EP - 32

BT - Electronic Packaging Materials Science VII

A2 - Borgesen, Peter

A2 - Jensen, Klavs F.

A2 - Pollak, Roger A.

PB - Publ by Materials Research Society

T2 - Proceedings of the Fall 1993 MRS Meeting

Y2 - 29 November 1993 through 3 December 1993

ER -

Material and reliability considerations for anisotropically conductive adhesive based interconnects

Abstract

Publication series

Conference

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