@inproceedings{ecb7eae631324b6587ea6356c88d1421,
title = "Mechanical design parameters for enhanced solder ball reliability of flip-chip PBGA package assembly",
abstract = "The warpage of a flip-chip plastic ball grid package assembly is documented while cooling the assembly from the underfill curing temperature to -40°C. The results reveal the effect of the constraints from the chip and the PCB on the global behavior of the substrate. The constraints produce an inflection point of the substrate at the edge of the chip. An experimentally verified 3-D non-linear FEM analysis proceeds to quantify the effect of the substrate behavior on the strains of assembly-level solder balls. The results from an extensive parametric study indicates that the CTE of substrate is the most critical design parameter for optimum solder ball reliability.",
author = "Kaushal Verma and Park, \{Seung Bae\} and Bongtae Han",
year = "2001",
language = "English",
isbn = "0791835405",
series = "Advances in Electronic Packaging",
pages = "569--575",
booktitle = "Advances in Electronic Packaging; Electrical Design, Simulation, and Test, Mems, Materials and Processing, Modeling and Characterization",
note = "Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition ; Conference date: 08-07-2001 Through 13-07-2001",
}