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Metal-induced growth of poly-Si on foreign substrates for solar cell applications

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

A new technological method of producing 0.5-6μm thick device-quality poly-Si films at temperatures below 600°C has been developed. The technique relies on the epitaxial columnar growth of the Si crystals on the lattice-matching NiSi2 formed as a result of the Si deposition on a Ni prelayer, whose thickness is shown to influence the Si structure. The Si was sputtered onto the heated substrate which was previously coated with 25nm of Ni. Such metal-induced growth (MIG) of polysilicon is proven to be applicable to a variety of inexpensive, lightweight foreign substrates, with Ni disilicide providing a good back ohmic contact to the Si film. The MIG-diode performance is promising for solar cell applications.

Original languageEnglish
Title of host publicationConference Record of the 28th IEEE Photovoltaic Specialists Conference - 2000
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages154-157
Number of pages4
ISBN (Electronic)0780357728
DOIs
StatePublished - 2000
Event28th IEEE Photovoltaic Specialists Conference, PVSC 2000 - Anchorage, United States
Duration: Sep 15 2000Sep 22 2000

Publication series

NameConference Record of the IEEE Photovoltaic Specialists Conference
Volume2000-January

Conference

Conference28th IEEE Photovoltaic Specialists Conference, PVSC 2000
Country/TerritoryUnited States
CityAnchorage
Period09/15/0009/22/00

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