Abstract
Preliminary results from solderability studies of Pb/Sn solder alloys wetting Au metallization are presented. The focus of these studies is to elucidate the physicochemical aspects of solderibility, in particular the relationship between liquid composition and wetting. Spreading front morphology is discussed and a possible mechanism for observed rapid spreading sequences is advanced. A composition study of a spreading sequence exhibiting a precursor film is presented along with a discussion of the role of the film in the overall wetting process.
| Original language | English |
|---|---|
| Pages (from-to) | 1-10 |
| Number of pages | 10 |
| Journal | [No source information available] |
| State | Published - 1991 |
| Event | ASME Winter Annual Meeting - Atlanta, GA, USA Duration: Dec 1 1991 → Dec 6 1991 |
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