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Modelling of viscous squeeze-film damping and the edge correction for perforated microstructures having a special pattern of holes

  • State University of New York Binghamton University
  • National University of Science and Technology POLITEHNICA Bucharest

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This paper contains an analysis of the squeeze-film damping in micro-electromechanical devices having a planar microstructure containing a repetitive pattern of oval holes. The planar microstructures containing oval holes assure a better protection against dust particles and water drops than the microstructures having circular holes. Consequently, they should be preferred in designing protective surfaces for microphones working in natural environment. Analytical formulas are provided for designing a planar microstructure with a periodic system of staggered holes to create a structure having minimum squeeze-film damping with an assigned open area. For the planar microstructures containing aligned oval holes an edge correction is given which accounts for the finite size of real structures.

Original languageEnglish
Title of host publication2007 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC2007
Pages1025-1033
Number of pages9
DOIs
StatePublished - 2008
Event21st Biennial Conference on Mechanical Vibration and Noise, presented at - 2007 ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2007 - Las Vegas, NV, United States
Duration: Sep 4 2007Sep 7 2007

Publication series

Name2007 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC2007
Volume1 PART B

Conference

Conference21st Biennial Conference on Mechanical Vibration and Noise, presented at - 2007 ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2007
Country/TerritoryUnited States
CityLas Vegas, NV
Period09/4/0709/7/07

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