Moisture absorption and its effects on the performance of printed circuit materials

P. C. Liu; D. W. Wang; S. J. Fueniss; M. D. Poliks; J. Obrzut; L. M. Siperko; R. Chen; D. Havens; R. M. Murcko

Moisture absorption and its effects on the performance of printed circuit materials

P. C. Liu
, D. W. Wang
, S. J. Fueniss
, M. D. Poliks
, J. Obrzut
, L. M. Siperko
, R. Chen
, D. Havens
, R. M. Murcko

School of Sys Sci Ind Engr

Binghamton University

IBM

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

4 Scopus citations

Abstract

This paper will discuss the moisture fundamental properties of two resins and their resin glass systems. These properties will be related to their assembly and reliability performance.

Original language	English
Title of host publication	Electronic Packaging Materials Science VII
Editors	Peter Borgesen, Klavs F. Jensen, Roger A. Pollak
Publisher	Publ by Materials Research Society
Pages	309-319
Number of pages	11
ISBN (Print)	1558992227
State	Published - 1994
Event	Proceedings of the Fall 1993 MRS Meeting - Boston, MA, USA Duration: Nov 29 1993 → Dec 3 1993

Publication series

Name	Materials Research Society Symposium Proceedings
Volume	323

Conference

Conference	Proceedings of the Fall 1993 MRS Meeting
City	Boston, MA, USA
Period	11/29/93 → 12/3/93

Cite this

Liu, P. C., Wang, D. W., Fueniss, S. J., Poliks, M. D., Obrzut, J., Siperko, L. M., Chen, R., Havens, D., & Murcko, R. M. (1994). Moisture absorption and its effects on the performance of printed circuit materials. In P. Borgesen, K. F. Jensen, & R. A. Pollak (Eds.), Electronic Packaging Materials Science VII (pp. 309-319). (Materials Research Society Symposium Proceedings; Vol. 323). Publ by Materials Research Society.

@inproceedings{1b284484e7e4460d83bb46ec2c59c4a3,

title = "Moisture absorption and its effects on the performance of printed circuit materials",

abstract = "This paper will discuss the moisture fundamental properties of two resins and their resin glass systems. These properties will be related to their assembly and reliability performance.",

author = "Liu, \{P. C.\} and Wang, \{D. W.\} and Fueniss, \{S. J.\} and Poliks, \{M. D.\} and J. Obrzut and Siperko, \{L. M.\} and R. Chen and D. Havens and Murcko, \{R. M.\}",

year = "1994",

language = "English",

isbn = "1558992227",

series = "Materials Research Society Symposium Proceedings",

publisher = "Publ by Materials Research Society",

pages = "309--319",

editor = "Peter Borgesen and Jensen, \{Klavs F.\} and Pollak, \{Roger A.\}",

booktitle = "Electronic Packaging Materials Science VII",

note = "Proceedings of the Fall 1993 MRS Meeting ; Conference date: 29-11-1993 Through 03-12-1993",

}

Liu, PC, Wang, DW, Fueniss, SJ, Poliks, MD, Obrzut, J, Siperko, LM, Chen, R, Havens, D & Murcko, RM 1994, Moisture absorption and its effects on the performance of printed circuit materials. in P Borgesen, KF Jensen & RA Pollak (eds), Electronic Packaging Materials Science VII. Materials Research Society Symposium Proceedings, vol. 323, Publ by Materials Research Society, pp. 309-319, Proceedings of the Fall 1993 MRS Meeting, Boston, MA, USA, 11/29/93.

Moisture absorption and its effects on the performance of printed circuit materials. / Liu, P. C.; Wang, D. W.; Fueniss, S. J. et al.
Electronic Packaging Materials Science VII. ed. / Peter Borgesen; Klavs F. Jensen; Roger A. Pollak. Publ by Materials Research Society, 1994. p. 309-319 (Materials Research Society Symposium Proceedings; Vol. 323).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Moisture absorption and its effects on the performance of printed circuit materials

AU - Liu, P. C.

AU - Wang, D. W.

AU - Fueniss, S. J.

AU - Poliks, M. D.

AU - Obrzut, J.

AU - Siperko, L. M.

AU - Chen, R.

AU - Havens, D.

AU - Murcko, R. M.

PY - 1994

Y1 - 1994

N2 - This paper will discuss the moisture fundamental properties of two resins and their resin glass systems. These properties will be related to their assembly and reliability performance.

AB - This paper will discuss the moisture fundamental properties of two resins and their resin glass systems. These properties will be related to their assembly and reliability performance.

UR - https://www.scopus.com/pages/publications/0027960025

M3 - Conference contribution

SN - 1558992227

T3 - Materials Research Society Symposium Proceedings

SP - 309

EP - 319

BT - Electronic Packaging Materials Science VII

A2 - Borgesen, Peter

A2 - Jensen, Klavs F.

A2 - Pollak, Roger A.

PB - Publ by Materials Research Society

T2 - Proceedings of the Fall 1993 MRS Meeting

Y2 - 29 November 1993 through 3 December 1993

ER -

Moisture absorption and its effects on the performance of printed circuit materials

Abstract

Publication series

Conference

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