TY - GEN
T1 - Moisture Diffusion and Hygroscopic Swelling of Adhesives in Electronics Packaging
AU - Liu, Ruiyang
AU - Wang, Huayan
AU - Wang, Jing
AU - Lee, Hohyung
AU - Park, S. B.
AU - Xue, Xiaojie
AU - Kim, Yeonsung
AU - Saiyed, Shafi
AU - Sengupta, Dipak
N1 - Publisher Copyright: © 2016 IEEE.
PY - 2016/8/16
Y1 - 2016/8/16
N2 - This paper presents a continuation of the previous hygroscopic characterization work on epoxy molding compounds, which aims to accurately measure the diffusivity and coefficient of hygroswelling (CHS) of a die-Attach adhesive in MEMS packages. We obtained the CHS of the adhesives from 25 °C to 150 °C through modified DIC quick scanning approach [1-2], which includes strain measurement by digital image correlation method and correction of weight loss through the Finite Element (FE) analysis. The CHS shows a dependence on temperature above the water evaporation temperature and ranges from 0.4 to 0.55 (strain/ percentage weight). The test accuracy of CHS was validated through a comparison with the correlation method [3] of in situ hygroswelling and weight loss. From moisture absorption and desorption curves of the adhesive samples, we obtained the diffusivities at different temperatures. A notable finding is that bulk samples follow the Fick's diffusion model while the thin-film samples demonstrate a non-Fickian behavior. By adding a concentration-dependent coefficient to the diffusivity's expression, the non-Fickian model can also be implemented in the FE models. As an outcome, a thorough guideline for measurement procedure is provided for hygroscopic characterization in electronics packaging.
AB - This paper presents a continuation of the previous hygroscopic characterization work on epoxy molding compounds, which aims to accurately measure the diffusivity and coefficient of hygroswelling (CHS) of a die-Attach adhesive in MEMS packages. We obtained the CHS of the adhesives from 25 °C to 150 °C through modified DIC quick scanning approach [1-2], which includes strain measurement by digital image correlation method and correction of weight loss through the Finite Element (FE) analysis. The CHS shows a dependence on temperature above the water evaporation temperature and ranges from 0.4 to 0.55 (strain/ percentage weight). The test accuracy of CHS was validated through a comparison with the correlation method [3] of in situ hygroswelling and weight loss. From moisture absorption and desorption curves of the adhesive samples, we obtained the diffusivities at different temperatures. A notable finding is that bulk samples follow the Fick's diffusion model while the thin-film samples demonstrate a non-Fickian behavior. By adding a concentration-dependent coefficient to the diffusivity's expression, the non-Fickian model can also be implemented in the FE models. As an outcome, a thorough guideline for measurement procedure is provided for hygroscopic characterization in electronics packaging.
KW - Die-Attach adhesives
KW - Hygroscopic swelling
KW - Moisture diffusion
KW - Non-Fickian diffusion
UR - https://www.scopus.com/pages/publications/84987802531
U2 - 10.1109/ECTC.2016.385
DO - 10.1109/ECTC.2016.385
M3 - Conference contribution
T3 - Proceedings - Electronic Components and Technology Conference
SP - 2203
EP - 2209
BT - Proceedings - ECTC 2016
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 66th IEEE Electronic Components and Technology Conference, ECTC 2016
Y2 - 31 May 2016 through 3 June 2016
ER -