Skip to main navigation Skip to search Skip to main content

Molecular Dynamics simulations of thermal conductivity in composites consisting of aluminum oxide nanoparticles surrounded by polyethylene oxide

  • State University of New York Binghamton University

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

4 Scopus citations

Abstract

Molecular Dynamics (MD) simulations of heat flow in the composite systems consisting of aluminum oxide nanostructures surrounded by polyethylene oxide were performed using known forcefields with consistent treatment of covalent (polymer) and ionic (nanoparticles) components. A reverse non-equilibrium molecular dynamics (RNEMD) method [1] implemented in open source MD Simulator LAMMPS [2] was utilized to impose a temperature gradient and obtain the values of thermal conductivity. Several simulation boxes containing layers (4 nm and 20 nm width) and spheres (3 nm and 6 nm radii) of aluminum oxide surrounded by polyethylene oxide have been built, equilibrated and subjected to RNEMD. The sizes of the boxes varied from 10/15 nm × 10/15 nm × 45/200 nm. The boxes contained 0.6∗106 to 3∗106 atoms. An enhancement of effective thermal conductivity from 0.3 W/m·K (for pure polymer) up to 1.1 W/m·K was achieved for the composites containing multiple 20 nm layers of aluminum oxide. The value of interfacial thermal resistance at the aluminum oxide/polymer interface obtained from the simulations was approximately 5∗10-9 m2K/W. Temperature profiles from RNEMD atomistic simulations were compared to known bulk models. Patterns of time averaged local heat flux in different components of the composite systems were calculated.

Original languageEnglish
Title of host publication2015 IEEE 65th Electronic Components and Technology Conference, ECTC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1920-1925
Number of pages6
ISBN (Electronic)9781479986095
DOIs
StatePublished - Jul 15 2015
Event2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015 - San Diego, United States
Duration: May 26 2015May 29 2015

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2015-July

Conference

Conference2015 65th IEEE Electronic Components and Technology Conference, ECTC 2015
Country/TerritoryUnited States
CitySan Diego
Period05/26/1505/29/15

Fingerprint

Dive into the research topics of 'Molecular Dynamics simulations of thermal conductivity in composites consisting of aluminum oxide nanoparticles surrounded by polyethylene oxide'. Together they form a unique fingerprint.

Cite this