TY - GEN
T1 - OPPORTUNITIES AND NEEDS FOR INTERFACIAL FRACTURE MECHANICS IN MICROELECTRONIC PACKAGING INDUSTRY
AU - Chen, William T.
AU - Questad, David
AU - Read, David
AU - Sammakia, Bahgat
N1 - Publisher Copyright: © 1997 American Society of Mechanical Engineers (ASME). All rights reserved.
PY - 1997
Y1 - 1997
N2 - This paper will review the trends for semiconductors, the impact on electronic products, and the requirements on electronic packaging materials, design, reliability and manufacturing. There is an increasing realization that materials and mechanics principles can be utilized to great advantage in electronic packaging industry. New electronic packages such as ball grid array modules (EGA), chip scale packages (CSP), MicroVia substrates, and low temperature solder bump assemblies, present interesting opportunities for the utilization of fracture mechanics principles in the analysis and modeling of those packages. This paper will present, from a packaging engineer's perspective, the utilization of interfaial fracture mechanics in the packaging community. Particular emphasis will be on fracture mechanics applied to interfaces in an assembled packaging structure.
AB - This paper will review the trends for semiconductors, the impact on electronic products, and the requirements on electronic packaging materials, design, reliability and manufacturing. There is an increasing realization that materials and mechanics principles can be utilized to great advantage in electronic packaging industry. New electronic packages such as ball grid array modules (EGA), chip scale packages (CSP), MicroVia substrates, and low temperature solder bump assemblies, present interesting opportunities for the utilization of fracture mechanics principles in the analysis and modeling of those packages. This paper will present, from a packaging engineer's perspective, the utilization of interfaial fracture mechanics in the packaging community. Particular emphasis will be on fracture mechanics applied to interfaces in an assembled packaging structure.
UR - https://www.scopus.com/pages/publications/85126944075
U2 - 10.1115/IMECE1997-0515
DO - 10.1115/IMECE1997-0515
M3 - Conference contribution
T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
SP - 183
EP - 192
BT - Application of Fracture Mechanics in Electronic Packaging
PB - American Society of Mechanical Engineers (ASME)
T2 - ASME 1997 International Mechanical Engineering Congress and Exposition, IMECE 1997 - Application of Fracture Mechanics in Electronic Packaging
Y2 - 16 November 1997 through 21 November 1997
ER -