@inproceedings{2cf6a821c0e24321b068e0e917d24472,
title = "Packaging of 20 kV Double-Side Cooled Silicon Carbide Diode Module With Electrical Insulation Enhanced by a Polymer-Nanoparticle Coating",
abstract = "To address the insulation challenges in packaging medium-voltage silicon carbide power devices, a package design for a 20-kV silicon carbide diode was developed. This design uses a nonlinear resistive polymer-nanoparticle composite to enhance insulation without sacrificing thermal performance. The {"}sandwich{"}structure, involving diodes connected between direct-bonded copper substrates, reduces parasitic inductance (<4.5 nH) in a wirebond-less design. This configuration results in a 41\% decrease in junction-to-case thermal resistance, according to thermal simulations. Coating electrode triple points with the resistive composite reduces electric field stress. Experimental tests revealed a 96\% increase in the partial discharge inception voltage of substrates from 15.6 kV to 30.6 kV. Scaled-down packages with 15 kV silicon carbide diodes was fabricated and tested for validation.",
keywords = "«Medium voltage», «Packaging», «Partial discharge», «Silicon Carbide», «Thermal management»",
author = "Zichen Zhang and Carl Nicholas and Arriola Emmanuel and Ngo, \{Khai D.T.\} and Lu, \{Guo Quan\} and Justin Lynch and Nick Yun and Adam Morgan and Woongje Sung",
note = "Publisher Copyright: {\textcopyright} 2023 EPE Association.; 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe ; Conference date: 04-09-2023 Through 08-09-2023",
year = "2023",
doi = "10.23919/EPE23ECCEEurope58414.2023.10264618",
language = "English",
series = "2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2023 25th European Conference on Power Electronics and Applications, EPE 2023 ECCE Europe",
}