Parametric studies of the thermal performance of a tape ball grid array (TBGA) package

Sandeep S. Tonapi; K. Srihari; Sanjeev B. Sathe; Bahgat B. Sammakia

Parametric studies of the thermal performance of a tape ball grid array (TBGA) package

Sandeep S. Tonapi
, K. Srihari
, Sanjeev B. Sathe
, Bahgat B. Sammakia

Binghamton University

State University of New York Binghamton University
Global Foundries, Inc.

Research output: Contribution to journal › Article › peer-review

Abstract

This paper deals with parametric studies to evaluate the thermal performance of a Tape Ball Grid Array (TBGA) package. A cover plate is attached to the back side of the chip to enhance heat transfer from the module. The package is attached to an organic carrier and placed in a vertical channel. A conjugate heat transfer model is used accounting for conduction in the package and the card and convection in the surrounding air. The effect of location of the TBGA on a card with 0, 1 and 2 power planes is evaluated for thermal performance. Five different locations of the TBGA on the card are investigated. Heat dissipation is studied for forced convection (2, 1, and 0.5m/s). No significant difference in chip junction temperatures for the different locations is observed. Temperature distribution along the card centerline and the module centerline are used to discuss the physical phenomenon that is occurring.

Original language	English
Pages (from-to)	425-429
Number of pages	5
Journal	American Society of Mechanical Engineers, Manufacturing Engineering Division, MED
Volume	11
State	Published - 2000

Cite this

@article{49d6aa9dda2a4ebd8959e7d16f8ae7a5,

title = "Parametric studies of the thermal performance of a tape ball grid array (TBGA) package",

abstract = "This paper deals with parametric studies to evaluate the thermal performance of a Tape Ball Grid Array (TBGA) package. A cover plate is attached to the back side of the chip to enhance heat transfer from the module. The package is attached to an organic carrier and placed in a vertical channel. A conjugate heat transfer model is used accounting for conduction in the package and the card and convection in the surrounding air. The effect of location of the TBGA on a card with 0, 1 and 2 power planes is evaluated for thermal performance. Five different locations of the TBGA on the card are investigated. Heat dissipation is studied for forced convection (2, 1, and 0.5m/s). No significant difference in chip junction temperatures for the different locations is observed. Temperature distribution along the card centerline and the module centerline are used to discuss the physical phenomenon that is occurring.",

author = "Tonapi, \{Sandeep S.\} and K. Srihari and Sathe, \{Sanjeev B.\} and Sammakia, \{Bahgat B.\}",

year = "2000",

language = "English",

volume = "11",

pages = "425--429",

journal = "American Society of Mechanical Engineers, Manufacturing Engineering Division, MED",

}

TY - JOUR

T1 - Parametric studies of the thermal performance of a tape ball grid array (TBGA) package

AU - Tonapi, Sandeep S.

AU - Srihari, K.

AU - Sathe, Sanjeev B.

AU - Sammakia, Bahgat B.

PY - 2000

Y1 - 2000

N2 - This paper deals with parametric studies to evaluate the thermal performance of a Tape Ball Grid Array (TBGA) package. A cover plate is attached to the back side of the chip to enhance heat transfer from the module. The package is attached to an organic carrier and placed in a vertical channel. A conjugate heat transfer model is used accounting for conduction in the package and the card and convection in the surrounding air. The effect of location of the TBGA on a card with 0, 1 and 2 power planes is evaluated for thermal performance. Five different locations of the TBGA on the card are investigated. Heat dissipation is studied for forced convection (2, 1, and 0.5m/s). No significant difference in chip junction temperatures for the different locations is observed. Temperature distribution along the card centerline and the module centerline are used to discuss the physical phenomenon that is occurring.

AB - This paper deals with parametric studies to evaluate the thermal performance of a Tape Ball Grid Array (TBGA) package. A cover plate is attached to the back side of the chip to enhance heat transfer from the module. The package is attached to an organic carrier and placed in a vertical channel. A conjugate heat transfer model is used accounting for conduction in the package and the card and convection in the surrounding air. The effect of location of the TBGA on a card with 0, 1 and 2 power planes is evaluated for thermal performance. Five different locations of the TBGA on the card are investigated. Heat dissipation is studied for forced convection (2, 1, and 0.5m/s). No significant difference in chip junction temperatures for the different locations is observed. Temperature distribution along the card centerline and the module centerline are used to discuss the physical phenomenon that is occurring.

UR - https://www.scopus.com/pages/publications/0041114596

M3 - Article

VL - 11

SP - 425

EP - 429

JO - American Society of Mechanical Engineers, Manufacturing Engineering Division, MED

JF - American Society of Mechanical Engineers, Manufacturing Engineering Division, MED

ER -

Parametric studies of the thermal performance of a tape ball grid array (TBGA) package

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