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Performance and reliability of sub-100nm TaSiN metal gate fully-depleted SOI devices with high-k (HfO 2) gate dielectric

  • A. V.Y. Thean
  • , A. Vandooren
  • , S. Kalpat
  • , Y. Du
  • , I. To
  • , J. Hughes
  • , T. Stephens
  • , B. Goolsby
  • , T. White
  • , A. Barr
  • , L. Mathew
  • , M. Huang
  • , S. Egley
  • , M. Zavala
  • , D. Eades
  • , K. Sphabmixay
  • , J. Schaeffer
  • , D. Triyoso
  • , M. Rossow
  • , D. Roan
  • D. Pham, R. Rai, S. Murphy, B. Y. Nguyen, B. E. White, A. Duvallet, T. Dao, J. Mogab

Research output: Contribution to journalConference articlepeer-review

10 Scopus citations

Abstract

In this paper, we report the performance and reliability of sub-100nm TaSiN metal gate fully depleted SOI devices with high-k gate dielectric. Performance differences between fully-depleted and partially-depleted devices are highlighted. This is also the first time that an unique asymmetric degradation phenomenon between electron and hole mobility in metal/high-k devices is reported. Despite the use of high-k dielectric, we show that these devices exhibit superior reliability, noise and analog circuit performances.

Original languageEnglish
Pages (from-to)106-107
Number of pages2
JournalDigest of Technical Papers - Symposium on VLSI Technology
StatePublished - 2004
Event2004 Symposium on VLSI Technology - Digest of Technical Papers - Honolulu, HI, United States
Duration: Jun 15 2004Jun 17 2004

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