TY - GEN
T1 - Performance of Flexible Microwave Antenna Under Environmental Stress
AU - Enakerakpo, Emuobosan
AU - Umar, Ashraf I.
AU - Alhendi, Mohammed
AU - Richmond, Dylan
AU - Poliks, Mark D.
AU - Rovere, Tom
AU - Gonya, Stephen
N1 - Publisher Copyright: © 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - Flexible antennas are integral to the development of next generation electronics through reduction in SWaP resulting in improved capabilities. Here, we show the in-situ performance of flexible microwave antennas under environmental stress conditions based on MIL-STD-810 testing standards for the first time. Flexible dual-band antennas (2.4 GHz and 4.6 GHz) are fabricated by etching patterned Cu clad RO3003 and assessed for their performance under environmental stresses while operating at high temperature (65 °C), low temperature (-40 °C), in thermal shock between the high and low temperatures, temperature-humidity (85 °C / 85 % RH) or water immersion. Coated and non-coated antennas showed robustness during the environmental exposures as they could function satisfactorily under most stress conditions.
AB - Flexible antennas are integral to the development of next generation electronics through reduction in SWaP resulting in improved capabilities. Here, we show the in-situ performance of flexible microwave antennas under environmental stress conditions based on MIL-STD-810 testing standards for the first time. Flexible dual-band antennas (2.4 GHz and 4.6 GHz) are fabricated by etching patterned Cu clad RO3003 and assessed for their performance under environmental stresses while operating at high temperature (65 °C), low temperature (-40 °C), in thermal shock between the high and low temperatures, temperature-humidity (85 °C / 85 % RH) or water immersion. Coated and non-coated antennas showed robustness during the environmental exposures as they could function satisfactorily under most stress conditions.
KW - Aerosol jet printing
KW - Environmental stress
KW - Flexible antenna
KW - Radio frequency
UR - https://www.scopus.com/pages/publications/85134653445
U2 - 10.1109/ECTC51906.2022.00302
DO - 10.1109/ECTC51906.2022.00302
M3 - Conference contribution
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1927
EP - 1933
BT - Proceedings - IEEE 72nd Electronic Components and Technology Conference, ECTC 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 72nd IEEE Electronic Components and Technology Conference, ECTC 2022
Y2 - 31 May 2022 through 3 June 2022
ER -