Preliminary results of 3D-DDTC pixel detectors for the ATLAS upgrade

Alessandro La Rosa; M. Boscardin; G. F. Dalla Betta; G. Darbo; C. Gemme; H. Pernegger; C. Piemonte; M. Povoli; S. Ronchin; A. Zoboli; N. Zorzi; E. Bolle; M. Borri; C. Da Via; S. Dong; S. Fazio; P. Grenier; S. Grinstein; H. Gjersdal; P. Hansson; F. Huegging; P. Jackson; M. Kocian; F. Rivero; O. Rohne; H. Sandaker; K. Sjobak; T. Slavicek; W. Tsung; D. Tsybychev; N. Wermes; C. Young

Preliminary results of 3D-DDTC pixel detectors for the ATLAS upgrade

Alessandro La Rosa
, M. Boscardin
, G. F. Dalla Betta
, G. Darbo
, C. Gemme
, H. Pernegger
, C. Piemonte
, M. Povoli
, S. Ronchin
, A. Zoboli
, N. Zorzi
, E. Bolle
, M. Borri
, C. Da Via
, S. Dong
, S. Fazio
, P. Grenier
, S. Grinstein
, H. Gjersdal
, P. Hansson

F. Huegging, P. Jackson, M. Kocian, F. Rivero, O. Rohne, H. Sandaker, K. Sjobak, T. Slavicek, W. Tsung, D. Tsybychev, N. Wermes, C. Young

Physics and Astronomy

Stony Brook University

CERN
ITC-IRST
University of Trento
National Institute for Nuclear Physics
University of Oslo
University of Turin
SLAC National Accelerator Laboratory
University of Calabria
University of Bergen
Czech Technical University in Prague
Stony Brook University
Institute for High Energy Physics

Research output: Contribution to journal › Conference article › peer-review

Abstract

3D Silicon sensors fabricated at FBK-irst with the Double-side Double Type Column (DDTC) approach and columnar electrodes only partially etched through p-type substrates were tested in laboratory and in a 1.35 Tesla magnetic field with a 180GeV pion beam at CERN SPS. The substrate thickness of the sensors is about 200μm, and different column depths are available, with overlaps between junction columns (etched from the front side) and ohmic columns (etched from the back side) in the range from 110μm to 150μm. The devices under test were bump bonded to the ATLAS Pixel readout chip (FEI3) at SELEX SI (Rome, Italy). We report leakage current and noise measurements, results of functional tests with Am²⁴¹ γ-ray sources, charge collection tests with Sr⁹⁰ β-source and an overview of preliminary results from the CERN beam test.

Original language	English
Journal	Proceedings of Science
State	Published - 2009
Event	9th International Conference on Large Scale Applications and Radiation Hardness of Semiconductor Detectors, RD 2009 - Florence, Italy Duration: Sep 30 2009 → Oct 2 2009

Cite this

@article{d08297ec69b34feeb316240b0e1298bf,

title = "Preliminary results of 3D-DDTC pixel detectors for the ATLAS upgrade",

abstract = "3D Silicon sensors fabricated at FBK-irst with the Double-side Double Type Column (DDTC) approach and columnar electrodes only partially etched through p-type substrates were tested in laboratory and in a 1.35 Tesla magnetic field with a 180GeV pion beam at CERN SPS. The substrate thickness of the sensors is about 200μm, and different column depths are available, with overlaps between junction columns (etched from the front side) and ohmic columns (etched from the back side) in the range from 110μm to 150μm. The devices under test were bump bonded to the ATLAS Pixel readout chip (FEI3) at SELEX SI (Rome, Italy). We report leakage current and noise measurements, results of functional tests with Am241 γ-ray sources, charge collection tests with Sr90 β-source and an overview of preliminary results from the CERN beam test.",

author = "\{La Rosa\}, Alessandro and M. Boscardin and \{Dalla Betta\}, \{G. F.\} and G. Darbo and C. Gemme and H. Pernegger and C. Piemonte and M. Povoli and S. Ronchin and A. Zoboli and N. Zorzi and E. Bolle and M. Borri and \{Da Via\}, C. and S. Dong and S. Fazio and P. Grenier and S. Grinstein and H. Gjersdal and P. Hansson and F. Huegging and P. Jackson and M. Kocian and F. Rivero and O. Rohne and H. Sandaker and K. Sjobak and T. Slavicek and W. Tsung and D. Tsybychev and N. Wermes and C. Young",

year = "2009",

language = "English",

journal = "Proceedings of Science",

issn = "1824-8039",

note = "9th International Conference on Large Scale Applications and Radiation Hardness of Semiconductor Detectors, RD 2009 ; Conference date: 30-09-2009 Through 02-10-2009",

}

La Rosa, A, Boscardin, M, Dalla Betta, GF, Darbo, G, Gemme, C, Pernegger, H, Piemonte, C, Povoli, M, Ronchin, S, Zoboli, A, Zorzi, N, Bolle, E, Borri, M, Da Via, C, Dong, S, Fazio, S, Grenier, P, Grinstein, S, Gjersdal, H, Hansson, P, Huegging, F, Jackson, P, Kocian, M, Rivero, F, Rohne, O, Sandaker, H, Sjobak, K, Slavicek, T, Tsung, W, Tsybychev, D, Wermes, N & Young, C 2009, 'Preliminary results of 3D-DDTC pixel detectors for the ATLAS upgrade', Proceedings of Science.

TY - JOUR

T1 - Preliminary results of 3D-DDTC pixel detectors for the ATLAS upgrade

AU - La Rosa, Alessandro

AU - Boscardin, M.

AU - Dalla Betta, G. F.

AU - Darbo, G.

AU - Gemme, C.

AU - Pernegger, H.

AU - Piemonte, C.

AU - Povoli, M.

AU - Ronchin, S.

AU - Zoboli, A.

AU - Zorzi, N.

AU - Bolle, E.

AU - Borri, M.

AU - Da Via, C.

AU - Dong, S.

AU - Fazio, S.

AU - Grenier, P.

AU - Grinstein, S.

AU - Gjersdal, H.

AU - Hansson, P.

AU - Huegging, F.

AU - Jackson, P.

AU - Kocian, M.

AU - Rivero, F.

AU - Rohne, O.

AU - Sandaker, H.

AU - Sjobak, K.

AU - Slavicek, T.

AU - Tsung, W.

AU - Tsybychev, D.

AU - Wermes, N.

AU - Young, C.

PY - 2009

Y1 - 2009

N2 - 3D Silicon sensors fabricated at FBK-irst with the Double-side Double Type Column (DDTC) approach and columnar electrodes only partially etched through p-type substrates were tested in laboratory and in a 1.35 Tesla magnetic field with a 180GeV pion beam at CERN SPS. The substrate thickness of the sensors is about 200μm, and different column depths are available, with overlaps between junction columns (etched from the front side) and ohmic columns (etched from the back side) in the range from 110μm to 150μm. The devices under test were bump bonded to the ATLAS Pixel readout chip (FEI3) at SELEX SI (Rome, Italy). We report leakage current and noise measurements, results of functional tests with Am241 γ-ray sources, charge collection tests with Sr90 β-source and an overview of preliminary results from the CERN beam test.

AB - 3D Silicon sensors fabricated at FBK-irst with the Double-side Double Type Column (DDTC) approach and columnar electrodes only partially etched through p-type substrates were tested in laboratory and in a 1.35 Tesla magnetic field with a 180GeV pion beam at CERN SPS. The substrate thickness of the sensors is about 200μm, and different column depths are available, with overlaps between junction columns (etched from the front side) and ohmic columns (etched from the back side) in the range from 110μm to 150μm. The devices under test were bump bonded to the ATLAS Pixel readout chip (FEI3) at SELEX SI (Rome, Italy). We report leakage current and noise measurements, results of functional tests with Am241 γ-ray sources, charge collection tests with Sr90 β-source and an overview of preliminary results from the CERN beam test.

UR - https://www.scopus.com/pages/publications/85215015584

M3 - Conference article

SN - 1824-8039

JO - Proceedings of Science

JF - Proceedings of Science

T2 - 9th International Conference on Large Scale Applications and Radiation Hardness of Semiconductor Detectors, RD 2009

Y2 - 30 September 2009 through 2 October 2009

ER -

Preliminary results of 3D-DDTC pixel detectors for the ATLAS upgrade

Abstract

Other files and links

Fingerprint

Cite this