Abstract
Monolithically integrated lasers on silicon photonics enable scalable, foundry-compatible production for data communications applications. However, material mismatches in heteroepitaxial systems and high coupling losses pose challenges for III-V integration on silicon. We combine three techniques: recessed silicon pockets for III-V growth, two-step heteroepitaxy using both MOCVD and MBE, and a polymer facet gap-fill approach to develop O-band InAs quantum dot lasers monolithically integrated on silicon photonics chiplets. Lasers coupled to silicon ring resonators and silicon nitride distributed Bragg reflectors (DBR) demonstrate single-mode lasing with side-mode suppression ratio up to 32 dB. Devices lase at temperatures up to 105 °C with an extrapolated operational lifetime of 6.2 years at 35 °C.
| Original language | English |
|---|---|
| Pages (from-to) | 5773-5781 |
| Number of pages | 9 |
| Journal | Journal of Lightwave Technology |
| Volume | 43 |
| Issue number | 12 |
| DOIs | |
| State | Published - 2025 |
Keywords
- Active-passive coupling
- DBR laser
- III-V on Si integration
- O-band
- monolithic integration
- optical coupling
- quantum dot laser
- semiconductor laser
- silicon photonics
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