Reliability issues in direct chip attach assemblies using reflow or no-flow underfill

Viraj Patwardhan; Daniel Blass; Peter Borgesen; K. Srihari

doi:10.1109/IEMT.2002.1032726

Reliability issues in direct chip attach assemblies using reflow or no-flow underfill

Viraj Patwardhan
, Daniel Blass
, Peter Borgesen
, K. Srihari

School of Sys Sci Ind Engr

Binghamton University

Research output: Contribution to journal › Article › peer-review

3 Scopus citations

Abstract

To date, the use of flip-chips for commercial applications has drawn significant interest. The encapsulation or underfilling of flip chips is critical for the widespread success of flip-chip-on-board type assemblies. An overview is given on experimental work that evaluated reflow or no-flow underfill materials. Parameters varied for the evaluation, including, encapsulant dispense pattern, passivation type, die pitch, and bump layout are highlighted.

Original language	English
Article number	13
Pages (from-to)	73-77
Number of pages	5
Journal	Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium
DOIs	https://doi.org/10.1109/IEMT.2002.1032726
State	Published - 2002

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10.1109/IEMT.2002.1032726

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title = "Reliability issues in direct chip attach assemblies using reflow or no-flow underfill",

abstract = "To date, the use of flip-chips for commercial applications has drawn significant interest. The encapsulation or underfilling of flip chips is critical for the widespread success of flip-chip-on-board type assemblies. An overview is given on experimental work that evaluated reflow or no-flow underfill materials. Parameters varied for the evaluation, including, encapsulant dispense pattern, passivation type, die pitch, and bump layout are highlighted.",

author = "Viraj Patwardhan and Daniel Blass and Peter Borgesen and K. Srihari",

year = "2002",

doi = "10.1109/IEMT.2002.1032726",

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AU - Patwardhan, Viraj

AU - Blass, Daniel

AU - Borgesen, Peter

AU - Srihari, K.

PY - 2002

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N2 - To date, the use of flip-chips for commercial applications has drawn significant interest. The encapsulation or underfilling of flip chips is critical for the widespread success of flip-chip-on-board type assemblies. An overview is given on experimental work that evaluated reflow or no-flow underfill materials. Parameters varied for the evaluation, including, encapsulant dispense pattern, passivation type, die pitch, and bump layout are highlighted.

AB - To date, the use of flip-chips for commercial applications has drawn significant interest. The encapsulation or underfilling of flip chips is critical for the widespread success of flip-chip-on-board type assemblies. An overview is given on experimental work that evaluated reflow or no-flow underfill materials. Parameters varied for the evaluation, including, encapsulant dispense pattern, passivation type, die pitch, and bump layout are highlighted.

UR - https://www.scopus.com/pages/publications/0036397179

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DO - 10.1109/IEMT.2002.1032726

M3 - Article

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JF - Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

M1 - 13

ER -

Reliability issues in direct chip attach assemblies using reflow or no-flow underfill

Abstract

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