Reliability of lead-free copper columns in comparison with tin-lead solder column interconnects

S. B. Park; Rahul Joshi; Lewis Goldmann

Reliability of lead-free copper columns in comparison with tin-lead solder column interconnects

S. B. Park
, Rahul Joshi
, Lewis Goldmann

Mechanical Engineering

Binghamton University

State University of New York Binghamton University
Global Foundries, Inc.

Research output: Contribution to journal › Conference article › peer-review

5 Scopus citations

Abstract

The thermo mechanical behavior of the ceramic lead-free copper column grid array (CuCGA) package has been characterized under accelerated thermal cycling using high sensitivity moiré interferometry and compared with conventional ceramic tin-lead column grid arrays (CCGA). Unlike tin-lead columns, where the failure occurs at the column near the top of the solder fillet and through the thickness of the column, in the CuCGA, the failure is found to occur first in the solder fillet along the periphery of the copper column that propagates along the boundary of the column and solder fillet. The accumulated plastic deformation per cycle is bigger in tin-lead columns compared to the copper columns. A deformation mechanism is provided to explain the nature of this failure.

Original language	English
Pages (from-to)	82-89
Number of pages	8
Journal	Proceedings - Electronic Components and Technology Conference
Volume	1
State	Published - 2004
Event	2004 Proceedings - 54th Electronic Components and Technology Conference - Las Vegas, NV, United States Duration: Jun 1 2004 → Jun 4 2004

Cite this

@article{05d55788d9894a25a2bddf6dc0673f6d,

title = "Reliability of lead-free copper columns in comparison with tin-lead solder column interconnects",

abstract = "The thermo mechanical behavior of the ceramic lead-free copper column grid array (CuCGA) package has been characterized under accelerated thermal cycling using high sensitivity moir{\'e} interferometry and compared with conventional ceramic tin-lead column grid arrays (CCGA). Unlike tin-lead columns, where the failure occurs at the column near the top of the solder fillet and through the thickness of the column, in the CuCGA, the failure is found to occur first in the solder fillet along the periphery of the copper column that propagates along the boundary of the column and solder fillet. The accumulated plastic deformation per cycle is bigger in tin-lead columns compared to the copper columns. A deformation mechanism is provided to explain the nature of this failure.",

author = "Park, \{S. B.\} and Rahul Joshi and Lewis Goldmann",

year = "2004",

language = "English",

volume = "1",

pages = "82--89",

journal = "Proceedings - Electronic Components and Technology Conference",

issn = "0569-5503",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "2004 Proceedings - 54th Electronic Components and Technology Conference ; Conference date: 01-06-2004 Through 04-06-2004",

}

TY - JOUR

T1 - Reliability of lead-free copper columns in comparison with tin-lead solder column interconnects

AU - Park, S. B.

AU - Joshi, Rahul

AU - Goldmann, Lewis

PY - 2004

Y1 - 2004

N2 - The thermo mechanical behavior of the ceramic lead-free copper column grid array (CuCGA) package has been characterized under accelerated thermal cycling using high sensitivity moiré interferometry and compared with conventional ceramic tin-lead column grid arrays (CCGA). Unlike tin-lead columns, where the failure occurs at the column near the top of the solder fillet and through the thickness of the column, in the CuCGA, the failure is found to occur first in the solder fillet along the periphery of the copper column that propagates along the boundary of the column and solder fillet. The accumulated plastic deformation per cycle is bigger in tin-lead columns compared to the copper columns. A deformation mechanism is provided to explain the nature of this failure.

AB - The thermo mechanical behavior of the ceramic lead-free copper column grid array (CuCGA) package has been characterized under accelerated thermal cycling using high sensitivity moiré interferometry and compared with conventional ceramic tin-lead column grid arrays (CCGA). Unlike tin-lead columns, where the failure occurs at the column near the top of the solder fillet and through the thickness of the column, in the CuCGA, the failure is found to occur first in the solder fillet along the periphery of the copper column that propagates along the boundary of the column and solder fillet. The accumulated plastic deformation per cycle is bigger in tin-lead columns compared to the copper columns. A deformation mechanism is provided to explain the nature of this failure.

UR - https://www.scopus.com/pages/publications/10444251749

M3 - Conference article

SN - 0569-5503

VL - 1

SP - 82

EP - 89

JO - Proceedings - Electronic Components and Technology Conference

JF - Proceedings - Electronic Components and Technology Conference

T2 - 2004 Proceedings - 54th Electronic Components and Technology Conference

Y2 - 1 June 2004 through 4 June 2004

ER -

Reliability of lead-free copper columns in comparison with tin-lead solder column interconnects

Abstract

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