Reliability of solder joints under electrical stressing - Strain evolution of solder joints

Hua Ye; Cemal Basaran; Douglas Hopkins; Alexander Cartwright

Reliability of solder joints under electrical stressing - Strain evolution of solder joints

Hua Ye
, Cemal Basaran
, Douglas Hopkins
, Alexander Cartwright

Department of Civil, Structural & Environmental Engineering

University at Buffalo

SUNY Buffalo

Research output: Contribution to conference › Paper › peer-review

2 Scopus citations

Abstract

Damage Mechanics of solder interconnects under electrical stressing is an important reliability issue for next generation power electronic packaging as well as for future IC packaging. The high electrical stressing in solder joints leads to electromigration and thus could not be ignored. In this paper, the state-of-the-art research on electromigration in solder joints is reviewed. An experimental electromigration study on solder joints is conducted and results are reported in this paper. The strain field in the solder joints under electrical stressing is measured with Moiré Interferometry technique.

Original language	English
Pages	946-952
Number of pages	7
State	Published - 2002
Event	8th Intersociety Conference on Thermal and Thermommechanical phenomena in Electronic Systems - San Diego, CA, United States Duration: May 30 2002 → Jun 1 2002

Conference

Conference	8th Intersociety Conference on Thermal and Thermommechanical phenomena in Electronic Systems
Country/Territory	United States
City	San Diego, CA
Period	05/30/02 → 06/1/02

Keywords

Electromigration
Electronic packaging
Moiré Intefferometry
Power electronics

Cite this

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title = "Reliability of solder joints under electrical stressing - Strain evolution of solder joints",

abstract = "Damage Mechanics of solder interconnects under electrical stressing is an important reliability issue for next generation power electronic packaging as well as for future IC packaging. The high electrical stressing in solder joints leads to electromigration and thus could not be ignored. In this paper, the state-of-the-art research on electromigration in solder joints is reviewed. An experimental electromigration study on solder joints is conducted and results are reported in this paper. The strain field in the solder joints under electrical stressing is measured with Moir{\'e} Interferometry technique.",

keywords = "Electromigration, Electronic packaging, Moir{\'e} Intefferometry, Power electronics",

author = "Hua Ye and Cemal Basaran and Douglas Hopkins and Alexander Cartwright",

year = "2002",

language = "English",

pages = "946--952",

note = "8th Intersociety Conference on Thermal and Thermommechanical phenomena in Electronic Systems ; Conference date: 30-05-2002 Through 01-06-2002",

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TY - CONF

T1 - Reliability of solder joints under electrical stressing - Strain evolution of solder joints

AU - Ye, Hua

AU - Basaran, Cemal

AU - Hopkins, Douglas

AU - Cartwright, Alexander

PY - 2002

Y1 - 2002

N2 - Damage Mechanics of solder interconnects under electrical stressing is an important reliability issue for next generation power electronic packaging as well as for future IC packaging. The high electrical stressing in solder joints leads to electromigration and thus could not be ignored. In this paper, the state-of-the-art research on electromigration in solder joints is reviewed. An experimental electromigration study on solder joints is conducted and results are reported in this paper. The strain field in the solder joints under electrical stressing is measured with Moiré Interferometry technique.

AB - Damage Mechanics of solder interconnects under electrical stressing is an important reliability issue for next generation power electronic packaging as well as for future IC packaging. The high electrical stressing in solder joints leads to electromigration and thus could not be ignored. In this paper, the state-of-the-art research on electromigration in solder joints is reviewed. An experimental electromigration study on solder joints is conducted and results are reported in this paper. The strain field in the solder joints under electrical stressing is measured with Moiré Interferometry technique.

KW - Electromigration

KW - Electronic packaging

KW - Moiré Intefferometry

KW - Power electronics

UR - https://www.scopus.com/pages/publications/0036457591

M3 - Paper

SP - 946

EP - 952

T2 - 8th Intersociety Conference on Thermal and Thermommechanical phenomena in Electronic Systems

Y2 - 30 May 2002 through 1 June 2002

ER -

Reliability of solder joints under electrical stressing - Strain evolution of solder joints

Abstract

Conference

Keywords

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