Abstract
The first bipolar transistor using selective epitaxy for base formation in a double-poly self-aligned structure is presented. The intrinsic base was formed by a selective-epitaxial deposition in place of ion implantation. Such epitaxial base processes are capable of achieving a narrow intrinsic base width and a high Gummel number which will lower the pinched intrinsic base sheet resistance Rbi and base-emitter diffusion capacitance C^ compared to advanced ion-implanted processes. A selective epitaxial base can be simply introduced in advanced double-poly self-aligned processes compared to a nonselective epitaxial layer.
| Original language | English |
|---|---|
| Pages (from-to) | 259-261 |
| Number of pages | 3 |
| Journal | IEEE Electron Device Letters |
| Volume | 9 |
| Issue number | 5 |
| DOIs | |
| State | Published - May 1988 |
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