Solder joint reliability prediction by the integrated matrix creep method

R. J. Iannuzzelli; J. M. Pitarresi; V. Prakash

doi:10.1115/1.2792132

Solder joint reliability prediction by the integrated matrix creep method

R. J. Iannuzzelli
, J. M. Pitarresi
, V. Prakash

CLT

Binghamton University

Hewlett-Packard
State University of New York Binghamton University

Research output: Contribution to journal › Article › peer-review

20 Scopus citations

Abstract

The integrated matrix creep method for predicting the fatigue life of solder joints is presented. The application of the matrix creep life prediction method to a variety of solder joint/load combinations with a comparison to measured reliability data is presented as a validation of this technique. For a leadless chip carrier, the strain distribution in the solder is studied both through modeling and laser Moire interferometry. Finally, using this methodology as a design tool, the fatigue life simulation of a gull wing leaded package is presented in which various design parameters are modified and their effect on the fatigue life determined.

Original language	English
Pages (from-to)	55-61
Number of pages	7
Journal	Journal of Electronic Packaging
Volume	118
Issue number	2
DOIs	https://doi.org/10.1115/1.2792132
State	Published - Jun 1996

Access to Document

10.1115/1.2792132

Cite this

@article{bc34779db49a4e59ac30f341d3c575fd,

title = "Solder joint reliability prediction by the integrated matrix creep method",

abstract = "The integrated matrix creep method for predicting the fatigue life of solder joints is presented. The application of the matrix creep life prediction method to a variety of solder joint/load combinations with a comparison to measured reliability data is presented as a validation of this technique. For a leadless chip carrier, the strain distribution in the solder is studied both through modeling and laser Moire interferometry. Finally, using this methodology as a design tool, the fatigue life simulation of a gull wing leaded package is presented in which various design parameters are modified and their effect on the fatigue life determined.",

author = "Iannuzzelli, \{R. J.\} and Pitarresi, \{J. M.\} and V. Prakash",

year = "1996",

month = jun,

doi = "10.1115/1.2792132",

language = "English",

volume = "118",

pages = "55--61",

journal = "Journal of Electronic Packaging",

issn = "1043-7398",

publisher = "American Society of Mechanical Engineers (ASME)",

number = "2",

}

TY - JOUR

T1 - Solder joint reliability prediction by the integrated matrix creep method

AU - Iannuzzelli, R. J.

AU - Pitarresi, J. M.

AU - Prakash, V.

PY - 1996/6

Y1 - 1996/6

N2 - The integrated matrix creep method for predicting the fatigue life of solder joints is presented. The application of the matrix creep life prediction method to a variety of solder joint/load combinations with a comparison to measured reliability data is presented as a validation of this technique. For a leadless chip carrier, the strain distribution in the solder is studied both through modeling and laser Moire interferometry. Finally, using this methodology as a design tool, the fatigue life simulation of a gull wing leaded package is presented in which various design parameters are modified and their effect on the fatigue life determined.

AB - The integrated matrix creep method for predicting the fatigue life of solder joints is presented. The application of the matrix creep life prediction method to a variety of solder joint/load combinations with a comparison to measured reliability data is presented as a validation of this technique. For a leadless chip carrier, the strain distribution in the solder is studied both through modeling and laser Moire interferometry. Finally, using this methodology as a design tool, the fatigue life simulation of a gull wing leaded package is presented in which various design parameters are modified and their effect on the fatigue life determined.

UR - https://www.scopus.com/pages/publications/0030165623

U2 - 10.1115/1.2792132

DO - 10.1115/1.2792132

M3 - Article

SN - 1043-7398

VL - 118

SP - 55

EP - 61

JO - Journal of Electronic Packaging

JF - Journal of Electronic Packaging

IS - 2

ER -

Solder joint reliability prediction by the integrated matrix creep method

Abstract

Access to Document

Other files and links

Fingerprint

Cite this