Solder metallization interdiffusion in microelectronic interconnects

A. Zribi; R. R. Chromik; R. Presthus; K. Teed; L. Zavalij; J. DeVita; J. Tova; Eric J. Cotts; James A. Clum; Robert Erich; A. Primavera; G. Westby; R. J. Coyle; G. M. Wenger

doi:10.1109/6144.846778

Solder metallization interdiffusion in microelectronic interconnects

A. Zribi
, R. R. Chromik
, R. Presthus
, K. Teed
, L. Zavalij
, J. DeVita
, J. Tova
, Eric J. Cotts
, James A. Clum
, Robert Erich
, A. Primavera
, G. Westby
, R. J. Coyle
, G. M. Wenger

Physics

Binghamton University

State University of New York Binghamton University
University of Detroit Mercy
Amkor Technology
Universal Instruments Corporation
Nokia

Research output: Contribution to journal › Article › peer-review

56 Scopus citations

Abstract

We investigated the growth of intermetallic compounds in Cu/Ni/Au/PbSn solder joints. The substrates that we investigated had been Au plated by one of two different techniques. The Au finish thicknesses ranged from 0.25 to 2.6 μm. After solder reflow, structural examinations using optical and electron microscopy of cross-sectioned solder joints revealed the growth of Ni₃Sn₄ at the solder/Ni interface after reflow. Solder joints with thicker layers of Au annealed in Ar gas at a temperature of 150°C for up to 450 h, displayed an appreciable growth of Au_0.5Ni_0.5Sn₄ at the Ni₃Sn₄/solder interface. Previous investigators correlated growth of a Au-Sn alloy with the degradation of the mechanical properties of the solder joint. The determination of the stoichiometry of the Au_0.5Ni_0.5Sn₄ phase provides some understanding of why this phase grew at the Ni₃Sn₄/solder interface, as Sn, Au and Ni are all readily available at this interface. The growth of this ternary alloy is also consistent with trends observed in the kinetics of formation of solder alloys.

Original language	English
Pages (from-to)	383-387
Number of pages	5
Journal	IEEE Transactions on Components and Packaging Technologies
Volume	23
Issue number	2
DOIs	https://doi.org/10.1109/6144.846778
State	Published - 2000

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Zribi, A., Chromik, R. R., Presthus, R., Teed, K., Zavalij, L., DeVita, J., Tova, J., Cotts, E. J., Clum, J. A., Erich, R., Primavera, A., Westby, G., Coyle, R. J., & Wenger, G. M. (2000). Solder metallization interdiffusion in microelectronic interconnects. IEEE Transactions on Components and Packaging Technologies, 23(2), 383-387. https://doi.org/10.1109/6144.846778

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title = "Solder metallization interdiffusion in microelectronic interconnects",

abstract = "We investigated the growth of intermetallic compounds in Cu/Ni/Au/PbSn solder joints. The substrates that we investigated had been Au plated by one of two different techniques. The Au finish thicknesses ranged from 0.25 to 2.6 μm. After solder reflow, structural examinations using optical and electron microscopy of cross-sectioned solder joints revealed the growth of Ni3Sn4 at the solder/Ni interface after reflow. Solder joints with thicker layers of Au annealed in Ar gas at a temperature of 150°C for up to 450 h, displayed an appreciable growth of Au0.5Ni0.5Sn4 at the Ni3Sn4/solder interface. Previous investigators correlated growth of a Au-Sn alloy with the degradation of the mechanical properties of the solder joint. The determination of the stoichiometry of the Au0.5Ni0.5Sn4 phase provides some understanding of why this phase grew at the Ni3Sn4/solder interface, as Sn, Au and Ni are all readily available at this interface. The growth of this ternary alloy is also consistent with trends observed in the kinetics of formation of solder alloys.",

author = "A. Zribi and Chromik, \{R. R.\} and R. Presthus and K. Teed and L. Zavalij and J. DeVita and J. Tova and Cotts, \{Eric J.\} and Clum, \{James A.\} and Robert Erich and A. Primavera and G. Westby and Coyle, \{R. J.\} and Wenger, \{G. M.\}",

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doi = "10.1109/6144.846778",

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pages = "383--387",

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T1 - Solder metallization interdiffusion in microelectronic interconnects

AU - Zribi, A.

AU - Chromik, R. R.

AU - Presthus, R.

AU - Teed, K.

AU - Zavalij, L.

AU - DeVita, J.

AU - Tova, J.

AU - Cotts, Eric J.

AU - Clum, James A.

AU - Erich, Robert

AU - Primavera, A.

AU - Westby, G.

AU - Coyle, R. J.

AU - Wenger, G. M.

PY - 2000

Y1 - 2000

N2 - We investigated the growth of intermetallic compounds in Cu/Ni/Au/PbSn solder joints. The substrates that we investigated had been Au plated by one of two different techniques. The Au finish thicknesses ranged from 0.25 to 2.6 μm. After solder reflow, structural examinations using optical and electron microscopy of cross-sectioned solder joints revealed the growth of Ni3Sn4 at the solder/Ni interface after reflow. Solder joints with thicker layers of Au annealed in Ar gas at a temperature of 150°C for up to 450 h, displayed an appreciable growth of Au0.5Ni0.5Sn4 at the Ni3Sn4/solder interface. Previous investigators correlated growth of a Au-Sn alloy with the degradation of the mechanical properties of the solder joint. The determination of the stoichiometry of the Au0.5Ni0.5Sn4 phase provides some understanding of why this phase grew at the Ni3Sn4/solder interface, as Sn, Au and Ni are all readily available at this interface. The growth of this ternary alloy is also consistent with trends observed in the kinetics of formation of solder alloys.

AB - We investigated the growth of intermetallic compounds in Cu/Ni/Au/PbSn solder joints. The substrates that we investigated had been Au plated by one of two different techniques. The Au finish thicknesses ranged from 0.25 to 2.6 μm. After solder reflow, structural examinations using optical and electron microscopy of cross-sectioned solder joints revealed the growth of Ni3Sn4 at the solder/Ni interface after reflow. Solder joints with thicker layers of Au annealed in Ar gas at a temperature of 150°C for up to 450 h, displayed an appreciable growth of Au0.5Ni0.5Sn4 at the Ni3Sn4/solder interface. Previous investigators correlated growth of a Au-Sn alloy with the degradation of the mechanical properties of the solder joint. The determination of the stoichiometry of the Au0.5Ni0.5Sn4 phase provides some understanding of why this phase grew at the Ni3Sn4/solder interface, as Sn, Au and Ni are all readily available at this interface. The growth of this ternary alloy is also consistent with trends observed in the kinetics of formation of solder alloys.

UR - https://www.scopus.com/pages/publications/0033706198

U2 - 10.1109/6144.846778

DO - 10.1109/6144.846778

M3 - Article

SN - 1521-3331

VL - 23

SP - 383

EP - 387

JO - IEEE Transactions on Components and Packaging Technologies

JF - IEEE Transactions on Components and Packaging Technologies

IS - 2

ER -

Solder metallization interdiffusion in microelectronic interconnects

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