Abstract
In the world of electronics materials, solder paste occupies a relatively small volume, yet it plays a critical role in electronics manufacturing/packaging. This chapter introduces the state of the art of lead-free solder paste technology, including the materials, the process, the reliability, and the challenges encountered. Five common ingredients constitute a standard solder paste: a solder alloy, a flux, an activator, a viscosity modifier, and a solvent. Two types of solder paste are reviewed in the chapter: Water-Soluble Solder Paste and No-Clean Solder Paste. The chapter discusses the characteristics of a solder paste, focusing on printing, reflow, in-circuit test probe testability, and flux reliability. It explores the relation between powder size and oxidation level of the solder powder.
| Original language | English |
|---|---|
| Title of host publication | Lead-free Soldering Process Development and Reliability |
| Publisher | John Wiley and Sons Inc. |
| Pages | 73-93 |
| Number of pages | 21 |
| ISBN (Electronic) | 9781119482093 |
| ISBN (Print) | 9781119482031 |
| DOIs | |
| State | Published - Jan 1 2020 |
Fingerprint
Dive into the research topics of 'Solder Paste and Flux Technology'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver