Special Issue on the 2006 International Symposium on Physical Design: Guest Editorial

Research output: Contribution to journal › Editorial

Original language	English
Pages (from-to)	617-618
Number of pages	2
Journal	IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Volume	26
Issue number	4
DOIs	https://doi.org/10.1109/TCAD.2007.892957
State	Published - Apr 2007

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@article{08c743e9b7c1444286e43d4ffedc0b24,

title = "Special Issue on the 2006 International Symposium on Physical Design: Guest Editorial",

author = "Jiang Hu and Madden, \{Patrick H.\}",

year = "2007",

month = apr,

doi = "10.1109/TCAD.2007.892957",

language = "English",

volume = "26",

pages = "617--618",

journal = "IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems",

issn = "0278-0070",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "4",

}

TY - JOUR

T1 - Special Issue on the 2006 International Symposium on Physical Design

T2 - Guest Editorial

AU - Hu, Jiang

AU - Madden, Patrick H.

PY - 2007/4

Y1 - 2007/4

UR - https://www.scopus.com/pages/publications/33947573553

U2 - 10.1109/TCAD.2007.892957

DO - 10.1109/TCAD.2007.892957

M3 - Editorial

SN - 0278-0070

VL - 26

SP - 617

EP - 618

JO - IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

JF - IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

IS - 4

ER -