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Study on Wiring and Mounting Structures for Smart Suits with Actuators

  • The University of Tokyo

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This study aims to develop smart suits that can press vibration motors against the body at the constant pressure to provide tactile feedback to the whole body. The structure using hyperelastic foam was proposed. The pressure was stable from 1.5 kPa to 2.0 kPa. The wiring structure that combines conductive fibers and flexible printed board were proposed to prevent inhabitation of movement and breakage.

Original languageEnglish
Title of host publication2022 International Conference on Electronics Packaging, ICEP 2022
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages83-84
Number of pages2
ISBN (Electronic)9784991191138
DOIs
StatePublished - 2022
Event21st International Conference on Electronics Packaging, ICEP 2022 - Sapporo, Japan
Duration: May 11 2022May 14 2022

Publication series

Name2022 International Conference on Electronics Packaging, ICEP 2022

Conference

Conference21st International Conference on Electronics Packaging, ICEP 2022
Country/TerritoryJapan
CitySapporo
Period05/11/2205/14/22

Keywords

  • Virtual reality
  • hyperelastic foam
  • tactile feedback

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