TY - GEN
T1 - Sub-modular circuit design for self-balancing series-connected IGBTs in a modular multilevel converter
AU - Yue, Lu
AU - Yao, Xiu
N1 - Publisher Copyright: © 2019 IEEE.
PY - 2019/5/24
Y1 - 2019/5/24
N2 - Series-connected IGBTs, when properly controlled, operate similarly to a single device with a much higher voltage capacity. Integrating series IGBTs into a Modular Multilevel Converter (MMC) can reduce its complexity without compromising the voltage capacity. This paper presents the circuit design on the sub-modular level of a MMC in which all the switching devices are series-connected IGBTs. The voltage sharing among the series IGBTs are regulated in a self-balancing manner. Therefore, no central series IGBT controller is needed, which greatly reduces the sensing and communication complexities, increasing the flexibility and expandability. Hardware experiment results demonstrate that the series IGBTs are able to self-regulate the voltage sharing in a fast and accurate manner and the system can operate similarly to a sub-module in a MMC. Current.
AB - Series-connected IGBTs, when properly controlled, operate similarly to a single device with a much higher voltage capacity. Integrating series IGBTs into a Modular Multilevel Converter (MMC) can reduce its complexity without compromising the voltage capacity. This paper presents the circuit design on the sub-modular level of a MMC in which all the switching devices are series-connected IGBTs. The voltage sharing among the series IGBTs are regulated in a self-balancing manner. Therefore, no central series IGBT controller is needed, which greatly reduces the sensing and communication complexities, increasing the flexibility and expandability. Hardware experiment results demonstrate that the series IGBTs are able to self-regulate the voltage sharing in a fast and accurate manner and the system can operate similarly to a sub-module in a MMC. Current.
UR - https://www.scopus.com/pages/publications/85067104513
U2 - 10.1109/APEC.2019.8722282
DO - 10.1109/APEC.2019.8722282
M3 - Conference contribution
T3 - Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC
SP - 3448
EP - 3452
BT - 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019
Y2 - 17 March 2019 through 21 March 2019
ER -