TY - GEN
T1 - Substrate and ground noise interactions in mixed-signal circuits
AU - Salman, Emre
AU - Friedman, Eby G.
AU - Secareanu, Radu M.
PY - 2006
Y1 - 2006
N2 - The interaction of the substrate with the inductive on-chip ground distribution network is analyzed in this paper. A transistor level approach is presented to illustrate the effects of the substrate on ground noise. The substrate can have a significant effect on ground noise due to the inductance of the ground lines. For a CMOS inverter, the substrate can reduce negative peak ground noise by 49% during the high-to-low output transition. The substrate, however, increases the positive peak ground noise by 72% during the low-to-high output transition. The effect of the substrate should therefore not be neglected if the inductance of the on-chip ground distribution network is non-negligible. Furthermore, conventional triangle or trapezoid type current demand estimations of the nonlinear circuits are shown to be significantly inaccurate if the ground lines exhibit inductive behavior.
AB - The interaction of the substrate with the inductive on-chip ground distribution network is analyzed in this paper. A transistor level approach is presented to illustrate the effects of the substrate on ground noise. The substrate can have a significant effect on ground noise due to the inductance of the ground lines. For a CMOS inverter, the substrate can reduce negative peak ground noise by 49% during the high-to-low output transition. The substrate, however, increases the positive peak ground noise by 72% during the low-to-high output transition. The effect of the substrate should therefore not be neglected if the inductance of the on-chip ground distribution network is non-negligible. Furthermore, conventional triangle or trapezoid type current demand estimations of the nonlinear circuits are shown to be significantly inaccurate if the ground lines exhibit inductive behavior.
UR - https://www.scopus.com/pages/publications/43749123436
U2 - 10.1109/SOCC.2006.283901
DO - 10.1109/SOCC.2006.283901
M3 - Conference contribution
SN - 0780397819
SN - 9780780397811
T3 - 2006 IEEE International Systems-on-Chip Conference, SOC
SP - 293
EP - 296
BT - 2006 IEEE International Systems-on-Chip Conference, SOC
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2006 IEEE International Systems-on-Chip Conference, SOC
Y2 - 24 September 2006 through 27 September 2006
ER -