Summary of recent studies of the effect of processing on microstructure of some solder alloys

J. Clum; E. Cotts; N. Jiang

Summary of recent studies of the effect of processing on microstructure of some solder alloys

J. Clum
, E. Cotts
, N. Jiang

Physics

Binghamton University

State University of New York Binghamton University

Research output: Contribution to conference › Paper › peer-review

Abstract

A variety of solder alloys selected from the Sn-based, and In-based systems, have been examined to test for the interaction of composition with processing conditions in controlling alloy microstructure. Rate of solidification, amount of compressive strain, annealing temperature and time were the independent variables studied. Grain size, phase fraction and microhardness have been monitored as measures of microstructural changes. A simple factorially designed experimental plan has been used to conduct and interpret the tests. A major effect of solidification rate and a secondary effect of the interaction between deformation and annealing was observed for most alloys. The effect of alloy composition is reflected primarily in terms of the role of T_ambient/T_m on microstructural stability. Some other processing related characteristics of these solder alloys will also be discussed such as creep and stress relaxation behavior.

Original language	English
Pages	137-143
Number of pages	7
State	Published - 1997
Event	Proceedings of the 1997 TMS Annual Meeting - Orlando, FL, USA Duration: Feb 10 1997 → Feb 13 1997

Conference

Conference	Proceedings of the 1997 TMS Annual Meeting
City	Orlando, FL, USA
Period	02/10/97 → 02/13/97

Cite this

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title = "Summary of recent studies of the effect of processing on microstructure of some solder alloys",

abstract = "A variety of solder alloys selected from the Sn-based, and In-based systems, have been examined to test for the interaction of composition with processing conditions in controlling alloy microstructure. Rate of solidification, amount of compressive strain, annealing temperature and time were the independent variables studied. Grain size, phase fraction and microhardness have been monitored as measures of microstructural changes. A simple factorially designed experimental plan has been used to conduct and interpret the tests. A major effect of solidification rate and a secondary effect of the interaction between deformation and annealing was observed for most alloys. The effect of alloy composition is reflected primarily in terms of the role of Tambient/Tm on microstructural stability. Some other processing related characteristics of these solder alloys will also be discussed such as creep and stress relaxation behavior.",

author = "J. Clum and E. Cotts and N. Jiang",

year = "1997",

language = "English",

pages = "137--143",

note = "Proceedings of the 1997 TMS Annual Meeting ; Conference date: 10-02-1997 Through 13-02-1997",

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TY - CONF

T1 - Summary of recent studies of the effect of processing on microstructure of some solder alloys

AU - Clum, J.

AU - Cotts, E.

AU - Jiang, N.

PY - 1997

Y1 - 1997

N2 - A variety of solder alloys selected from the Sn-based, and In-based systems, have been examined to test for the interaction of composition with processing conditions in controlling alloy microstructure. Rate of solidification, amount of compressive strain, annealing temperature and time were the independent variables studied. Grain size, phase fraction and microhardness have been monitored as measures of microstructural changes. A simple factorially designed experimental plan has been used to conduct and interpret the tests. A major effect of solidification rate and a secondary effect of the interaction between deformation and annealing was observed for most alloys. The effect of alloy composition is reflected primarily in terms of the role of Tambient/Tm on microstructural stability. Some other processing related characteristics of these solder alloys will also be discussed such as creep and stress relaxation behavior.

AB - A variety of solder alloys selected from the Sn-based, and In-based systems, have been examined to test for the interaction of composition with processing conditions in controlling alloy microstructure. Rate of solidification, amount of compressive strain, annealing temperature and time were the independent variables studied. Grain size, phase fraction and microhardness have been monitored as measures of microstructural changes. A simple factorially designed experimental plan has been used to conduct and interpret the tests. A major effect of solidification rate and a secondary effect of the interaction between deformation and annealing was observed for most alloys. The effect of alloy composition is reflected primarily in terms of the role of Tambient/Tm on microstructural stability. Some other processing related characteristics of these solder alloys will also be discussed such as creep and stress relaxation behavior.

UR - https://www.scopus.com/pages/publications/0031378180

M3 - Paper

SP - 137

EP - 143

T2 - Proceedings of the 1997 TMS Annual Meeting

Y2 - 10 February 1997 through 13 February 1997

ER -

Summary of recent studies of the effect of processing on microstructure of some solder alloys

Abstract

Conference

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