TY - GEN
T1 - Temperature effect of interfacial fracture toughness on underfill for Pb-free flip chip packages
AU - Seungbae, Park
AU - Zhenming, Tang
AU - Soonwan, Chung
PY - 2007
Y1 - 2007
N2 - In this study, the interfacial fracture toughness between passivation layer and underfill was investigated at elevated temperatures by performing conventional four-point bending test and finite element simulation. Since the board level reflow temperature for Pb-free flip chip packaging is reaching as high as 260 °C, the concern about delamination at the interfaces between underfill and its surrounding components becomes a more serious reliability issue. To estimate the interfacial strength, interfacial fracture toughness at a specific mixed mode loading condition is calculated. As temperature is increased, the interracial toughness was also increased up to the glass transition temperature. Beyond the glass transition temperature, however, interfacial fracture toughness is decreased.
AB - In this study, the interfacial fracture toughness between passivation layer and underfill was investigated at elevated temperatures by performing conventional four-point bending test and finite element simulation. Since the board level reflow temperature for Pb-free flip chip packaging is reaching as high as 260 °C, the concern about delamination at the interfaces between underfill and its surrounding components becomes a more serious reliability issue. To estimate the interfacial strength, interfacial fracture toughness at a specific mixed mode loading condition is calculated. As temperature is increased, the interracial toughness was also increased up to the glass transition temperature. Beyond the glass transition temperature, however, interfacial fracture toughness is decreased.
KW - Flip chip reliability
KW - Four-point bending
KW - Interfacial fracture toughess
KW - Pb-free solder
KW - Underfill
UR - https://www.scopus.com/pages/publications/35348827821
U2 - 10.1109/ECTC.2007.373783
DO - 10.1109/ECTC.2007.373783
M3 - Conference contribution
SN - 1424409853
SN - 9781424409853
T3 - Proceedings - Electronic Components and Technology Conference
SP - 105
EP - 109
BT - Proceedings - 57th Electronic Components and Technology Conference 2007, ECTC '07
T2 - 57th Electronic Components and Technology Conference 2007, ECTC '07
Y2 - 29 May 2007 through 1 June 2007
ER -