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Test beam results of 3D silicon pixel sensors for the ATLAS upgrade

  • P. Grenier
  • , G. Alimonti
  • , M. Barbero
  • , R. Bates
  • , E. Bolle
  • , M. Borri
  • , M. Boscardin
  • , C. Buttar
  • , M. Capua
  • , M. Cavalli-Sforza
  • , M. Cobal
  • , A. Cristofoli
  • , G. F. Dalla Betta
  • , G. Darbo
  • , C. Da Vià
  • , E. Devetak
  • , B. Dewilde
  • , B. Di Girolamo
  • , D. Dobos
  • , K. Einsweiler
  • D. Esseni, S. Fazio, C. Fleta, J. Freestone, C. Gallrapp, M. Garcia-Sciveres, G. Gariano, C. Gemme, M. P. Giordani, H. Gjersdal, S. Grinstein, T. Hansen, T. E. Hansen, P. Hansson, J. Hasi, K. Helle, M. Hoeferkamp, F. Hügging, P. Jackson, K. Jakobs, J. Kalliopuska, M. Karagounis, C. Kenney, M. Köhler, M. Kocian, A. Kok, S. Kolya, I. Korokolov, V. Kostyukhin, H. Krüger, A. La Rosa, C. H. Lai, N. Lietaer, M. Lozano, A. Mastroberardino, A. Micelli, C. Nellist, A. Oja, V. Oshea, C. Padilla, P. Palestri, S. Parker, U. Parzefall, J. Pater, G. Pellegrini, H. Pernegger, C. Piemonte, S. Pospisil, M. Povoli, S. Roe, O. Rohne, S. Ronchin, A. Rovani, E. Ruscino, H. Sandaker, S. Seidel, L. Selmi, D. Silverstein, K. Sjøbæk, T. Slavicek, S. Stapnes, B. Stugu, J. Stupak, D. Su, G. Susinno, R. Thompson, J. W. Tsung, D. Tsybychev, S. J. Watts, N. Wermes, C. Young, N. Zorzi
  • SLAC National Accelerator Laboratory
  • National Institute for Nuclear Physics
  • University of Bonn
  • University of Glasgow
  • University of Oslo
  • University of Manchester
  • ITC-IRST
  • University of Calabria
  • Institute for High Energy Physics
  • University of Udine
  • University of Trento
  • Stony Brook University
  • CERN
  • Lawrence Berkeley National Laboratory
  • Centro Nacional de Microelectrónica (IMB-CNM-CSIC)
  • ICREA
  • SINTEF
  • University of Bergen
  • University of New Mexico
  • University of Freiburg
  • VTT Technical Research Centre of Finland Ltd.
  • University of Hawai'i at Mānoa
  • Czech Technical University in Prague

Research output: Contribution to journalArticlepeer-review

22 Scopus citations

Abstract

Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable B-Layer and High Luminosity LHC (HL-LHC) upgrades are presented. Measurements include charge collection, tracking efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6 T magnetic field oriented as the ATLAS inner detector solenoid field. Sensors were bump-bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance.

Original languageEnglish
Pages (from-to)33-40
Number of pages8
JournalNuclear Inst. and Methods in Physics Research, A
Volume638
Issue number1
DOIs
StatePublished - May 11 2011

Keywords

  • 3D sensors
  • ATLAS upgrade
  • Radiation hard detectors
  • Silicon sensors

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