The Electrical and Mechanical Behaviors of Copper Thin Films Deposited on Polyethylene Terephthalate Under Tensile Stress

This study examines copper thin films under tensile stress and their shape and percentage change in electrical resistance (PCER) as a function of applied strain. Copper films of 100 and 200 nm thickness were sputtered onto polyethylene terephthalate (PET) substrates and were then sequentially stretched to examine how film thickness affects strain-induced morphological changes and electrical resistance. A scanning electron microscope (SEM) was used to track crack patterns, and electrical resistance was monitored throughout tensile testing. Thinner films (100 nm) had quick crack initiation and propagation, leading to an increase in PCER under strain, while thicker films (200 nm) had more gradual morphological and electrical resistance changes. This differential reaction demonstrates the importance of film thickness in mechanical deformation and strain sensitivity, which could affect the design of flexible electronic devices that require mechanical durability and reliable electrical performance. These findings will help to optimize film thickness for stretchable sensors and wearable electronics to balance strain sensitivity and morphological degradation. This study will help designers and users of sensors, stretchable electronics, and other devices that require mechanical durability and electrical performance to understand the relationship between mechanical deformation and electrical properties in thin films. This paper aligns with the ninth goal of the United Nations Sustainable Development Goals, specifically Target 9.5: Enhance Research and Upgrade Industrial Technologies.